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Top Ceramic Tray End Effector Manufacturers for Precision Handling

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Square beam & guide rail for ultra-precision motion platform and detection equipment

Square beam & guide rail for ultra-precision motion platform and detection equipment

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field
Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
Ceramic structural parts (ceramic parts)

Ceramic structural parts (ceramic parts)
Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
Wafer pin silicon carbide chuck(wafer clamping, prealigner chuck) used for semiconductor field

Wafer pin silicon carbide chuck(wafer clamping, prealigner chuck) used for semiconductor field

Top Selling Products

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance
Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams

Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
Porous ceramic with high temperature resistance, high strength, good chemical stability

Porous ceramic with high temperature resistance, high strength, good chemical stability
Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability
Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
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Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").

TSMC next week ahead of the trial production of 2nm chips, South Korea and Japan step by step to follow

Despite the growing sense of "word play" in chip process naming, semiconductor giants still want to take the lead in mass production schedules. Recently, Taiwan media revealed that chip ...

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