Industry News
Third generation semiconductor materials: silicon carbide and gallium nitride
Among the many wide-band gap materials, gallium nitride (GaN) and silicon carbide (SiC) are particularly prominent, which not only show great potential in switching applications, but also show bright prospects in the field of RF power.
Semiconductor - Bruce Marathon Express integrated platform application and data
Semiconductor
Wafer level bonding mechanism construction and core technology
Wafer-Level bonding for the vast majority of semiconductor practitioners should have less contact, after all, advanced packaging has just begun in recent years, and the process process of advanced packaging is wafer-bongding.
Detailed wafer testing (WAT)
With the rapid development of semiconductor technology, Wafer Acceptance Test (WAT) has become increasingly prominent in the semiconductor manufacturing process. The core goal of WAT testing is to ensure that the electrical characteristics and process parameters of wafers meet design standards before packaging and cutting, thereby improving product yield and reliability.
Excellent properties of high thermal conductivity aluminum nitride ceramic materials
With the rapid development of modern science and technology, material science, as one of the basic disciplines, has attracted increasing attention. High thermal conductivity aluminum nitride (AlN) ceramic material has gradually become an important material in electronics, optoelectronics, aerospace and other fields because of its excellent thermal conductivity and unique physical and chemical properties.
Semiconductor inspection technology - Summary of the difficulties and detection algorithms of bare wafer crack detection technology
As wafer sizes increase and become thinner and larger, the demand for higher accuracy and yield continues to increase. Mechanical stress in wafers during handling, cutting, or heat treatment may cause cracks. Cracks can also lead to reduced production and reliability failures. Therefore, one of the most critical problems in semiconductor packaging process is cracking.
Structural research and technology of semiconductor -Thermo Chuck (Temperature Chuck)
Wafer hot chucks are often used for wafer temperature testing. There are also other applications
Major equipment and material inventory in semiconductor manufacturing process
The processing process of semiconductor products mainly includes wafer manufacturing (Front, Front End) and packaging (Back, Back End) testing, with the penetration of advanced packaging technology, there is a processing link between wafer manufacturing and packaging, known as the Middle (Middle End).
Semiconductor manufacturing process
The wafer processing process mainly involves the fabrication of circuits and electronic components (such as transistors, capacitors, logic gates, etc.) on silicon wafers, which is the most complex and costly process among the aforementioned processes
