Industry News
Yu Chengdong: "Regarding TSMC's supply of high-end chips to China, can China break through?" Give your own answer
Huawei has demonstrated strong vitality and innovative spirit under the dual pressure of TSMC cutting off high-end chips and the US "chip bill". By launching the "Nanniwan" plan, actively diversifying its layout, and collaborating with domestic enterprises, Huawei strives to achieve self-sufficiency.
2025, the biggest variable of semiconductors
On November 6, the dust of the US federal election fell, and Trump won the 2024 presidential election and entered the White House again. As we all know, Trump has been nicknamed the "benefactor" of Chinese semiconductors, because the trade war launched by Trump in 2018 has comprehensively promoted the localization of Chinese semiconductors.
It's all turned back! ASML, the Dutch lithography machine suppliers have announced that foreign media: things are big
Recently, ASML, which is the leader in the field of lithography machines, actually wants to move part of the EUV lithography machine production line to the United States! This thing is not small, it is simply a "shock bomb" in the semiconductor industry, and everyone is a little confused.
Ying CAI and Colin have ordered suppliers to stop using Chinese parts
The Wall Street Journal reported that under pressure from the U.S. government, U.S. chip equipment makers Applied Materials and Lam Research have begun requiring suppliers not to use Chinese components, even if they have Chinese money or shareholders. Analysts believe that this move may be high costs, because it is not easy to find non-Chinese alternatives at the same price.
The "core strength" of semiconductor equipment - silicon carbide parts
Silicon carbide (SiC) is a kind of structural ceramic material with excellent properties
Research progress of aluminum nitride materials and devices
The ultra-wide bandgap semiconductor represented by aluminum nitride is the fourth generation of semiconductor materials after silicon, gallium arsenide, gallium nitride and silicon carbide, which has been recognized as the key technology to promote the rapid development of microelectronics technology and become the commanding point of technology competition in the world.
Sintering methods for special ceramics
The production steps of special ceramics can be roughly divided into three steps: the first step is the preparation of ceramic powder, the second step is forming, and the third step is sintering. Sintering is an important process in powder metallurgy, ceramics, refractory materials, ultra-high temperature materials and other industries.
Samsung, Intel will form a "foundry alliance" against TSMC
It has been confirmed that Intel has approached Samsung Electronics to establish a "contract manufacturing alliance."
Infineon opens the world's largest silicon carbide power semiconductor fab in Malaysia
Infineon Technologies AG has officially opened the first phase of a new fab in Malaysia that will be the world's largest and most competitive 200 mm silicon carbide (SiC) power semiconductor fab.
What are the advantages of vertical stacking of chips?
Wire bonding is an electrical connection between the pad on the chip and the pins on the package substrate with thin gold wires. The general process is the first point welding == "pull wire ==" The second point welding == "welding wire cutting and other steps.