Industry News
How thin can the Taiko process reduce silicon wafers?
The Taiko process is a wafer thinning technique that leaves the wafer edges unthinned and only thinned the central area of the wafer. This allows the central region of the wafer to achieve extremely thin thickness, while the edge of the wafer remains the original thickness.
Disco-DBG process details
DBG process, that is, Dicing Before Grinding, thinning after cutting. Dicing is the diamond blade cutting, Grinding is the back thinning, the process is developed by DISSO company in Japan.
Chip, chip, come on! Solve the development problems of semiconductors and chips in the era of interconnection
Almost every industry is undergoing a connected technology revolution. The rise of the Internet of Things (IoT), artificial intelligence (AI) and 5G has ushered in an era of unprecedented connectivity and automation. Along with this wave of progress, however, comes a huge demand for those humble silicon chips that are needed to power this new era of connectivity: semiconductors.
The principle, present situation and future of lithography machine
Lithography machine is the key equipment in the semiconductor manufacturing process, which is equivalent to the "printing press" of the chip manufacturing process, and its accuracy directly affects the process and performance of the chip.
Principle, process, method and equipment of wafer cleaning
Wet cleaning is one of the most important steps in the semiconductor manufacturing process to remove various contaminants from the wafer surface and ensure that subsequent process steps can be carried out on a Clean surface.
Evaluation parameters and application of dry etching
In RIE etching process, there are several key parameters used to evaluate the etching effect and process quality. These parameters include etching rate, selection ratio, critical size (CD), size offset, and etching pattern Angle.
Principle and process flow of dry etching
RIE dry etching technology has become an indispensable core process in semiconductor manufacturing due to its superior anisotropic etching ability and good selective ratio control.
Fabless operation mode, advantages, future trend
Chips, or semiconductors, are one of the core components of modern electronic devices. From mobile phones to computers, cars to televisions, almost all electronic devices rely on chips for a variety of computing and data-processing tasks.
Chemical vapor deposition CVD process for wafer fabrication
When manufacturing integrated circuits, sometimes it is necessary to deposit specific layers of materials on the surface of the silicon wafer (i.e. wafer), such as Silicon nitride (Si₃N₄) or silicon nitride (SiON). These layers of material cannot be generated directly from the substrate, so we use a method called chemical vapor deposition (CVD).
Semiconductor ceramic parts preparation technology
The preparation process of semiconductor ceramic parts mainly includes powder preparation, powder molding, high temperature sintering, precision machining, quality inspection, surface treatment and so on.