Industry News
Chinese Americans said: China's 7nm is just a digital game, not only the performance has not improved, but also there is a 10-year technology gap with the United States
In an interview, Jen-Hsun Huang, a Chinese-American, said of Huawei's chip process: I am not surprised that Huawei says it is 7 nm, 14 nm or 7 nm, there is no problem in making mobile phones, they are just a number, but the performance has not improved. In semiconductors, we're about 10 years ahead.
TSMC 1.6nm technology A16 for the first time! Mass production will begin in 2026
TSMC is the world's largest contract manufacturer of advanced chips and a major partner of Nvidia and Apple.
First time! Smic's revenue surpassed UMC and GF to become the world's second largest
Smic said it aimed to grow sales above the average of comparable peers, assuming no significant changes in the external environment.
Poaching Micron, TSMC, Intel foundry business is still saved
According to Singapore's Business Times, after its contract manufacturing business suffered billions of dollars in losses, Intel hired Naga Chandrasekaran, a Micron veteran in charge of process technology development, as its chief operating officer.
Semiconductor FAB gas
In the manufacturing process of semiconductor wafer foundries, which currently have more advanced production processes, nearly 50 different kinds of gases are used. Generally, Gas is divided into Bulk Gas and Special Gas.
Lam Research Product Library (2)
The etching process assists in the formation of chip components by selectively removing dielectric (insulating) and metallic (conductive) materials added during deposition.
Lam Research Product Library (1)
The deposition process can be used to form dielectric (insulating) layers and metallic (conductive) materials for building semiconductor devices. Depending on the specific material and structure type, different techniques are required. Electrochemical deposition (ECD) is used to form copper "wires" (interconnects) that connect devices in an integrated circuit.
ESD electrostatic protection principle and design
Electrostatic Discharge (ESD: Electrostatic Discharge) should be the main culprit of excessive Electrical Stress (EOS: Electrical Over Stress) damage caused by all electronic components or integrated circuit systems
Integrated circuit manufacturing process
The manufacture of integrated circuit is the process of constructing the designed circuit diagram on the prepared silicon wafer through many complex processes, and finally conducting the sealing test.
Summary of global silicon wafer manufacturers
Silicon wafers are cutting-edge high-tech products with extremely high manufacturing technology barriers, and only about 10 companies in the world can manufacture them.