Industry News
Third generation semiconductor SiC
Semiconductor materials are usually divided into three generations according to the chronological order of research and large-scale application.
Invest 14.5 billion yuan, SiC giant expansion!
The investment of brownfield project is the result of a similar move by ST, also used in silicon carbide chips - in Italy, and by Intel and TSMC in Germany.
A year up 335.2%, the global gallium nitride leader opened the IPO
Securities Times network news, in the wave of change in the global semiconductor industry, China's power is rising strongly. On the evening of June 12, the global gallium nitride industry leader -- Innoseco (Suzhou) Technology Co., LTD. (hereinafter referred to as: Innoseco) formally submitted an application for listing to the Hong Kong Stock Exchange, marking that the third-generation semiconductor giant is about to emerge on the international capital stage.
Chip trend: New battles and new battlefields for silicon carbide
At present, the rapid development of silicon carbide market on the one hand, there is a competitive situation of price reduction, on the other hand, new market applications are also appearing.
Over $600 billion! TSMC to rise, domestic chip manufacturers ushered in an outbreak? Mobile phone chips will rise?
Since entering the era of artificial intelligence, Huang Renxun has sadly become the "topic king". At the Taiwan Computer Festival, Huang said in an interview: "I think TSMC's price is too low, TSMC's contribution to the world and the technology industry, from the financial report is aggrieved." Unexpectedly, a prophecy! The global semiconductor price rise tide is really coming!
ASE will build a second test plant in the United States and will also expand in Mexico/Malaysia/Japan
On June 26, the global sealed test leader ASE Investment Control CEO Wu Tianyu revealed in a media interview after the shareholders meeting that in order to respond to customers' requirements for regional politics and supply chain restructuring, ASE Investment Control has considered setting up factories in Japan, Mexico, the United States, Malaysia and other countries, and does not exclude the expansion of advanced packaging capacity in Japan, the United States and Mexico.
The world's first 2nm chip was born, and TSMC lagged behind
TSMC's feud with IBM has focused on competition over semiconductor technology. IBM had an early advantage in copper process technology, but TSMC responded quickly, successfully developed and mass-produced copper process chips, and achieved a technological breakthrough before IBM.
Us-japan-south Korea chip alliance cracks!
According to the website of the US Department of Commerce, on June 26, local time, US Secretary of Commerce Raymond met with South Korea's Minister of Trade and Industry and Energy Undergun and Japan's Minister of Economy, Trade and Industry Ken Saito in Washington. In a joint statement, the three reiterated the importance of strengthening supply chains for "critical products", including chips, while expressing concern about what they called "non-market measures".
Four years later, American workers still don't want to be TSMC's cattle and horses
TSMC is getting another hot search in the US. According to Rest of World, a former TSMC employee said: "TSMC is the worst employer on the planet."
The main method and technology of Die Bonding
Die bonding is a process for mounting a chip on a package substrate. This paper introduces several main chip bonding methods and processes in detail.