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The preparation process of semiconductor ceramic parts mainly includes powder preparation, powder molding, high temperature sintering, precision machining, quality inspection, surface treatment and so on.

Due to the excellent properties of ceramic parts such as high temperature resistance and corrosion resistance, they are often used in various semiconductor key equipment.

In order to improve the properties of silicon carbide diffusion and fracture toughness, the sample has to be sintered at high temperatures, but the high temperature will limit its application, the best solution is to use sintering additives or use some special processes to increase the density of silicon carbide.

SiC represents the third generation of semiconductors

Samsung Electronics has embarked on a domain-centered and comprehensive reorganization.

Traditional wafer clamping methods include: mechanical clamping, paraffin bonding and other methods commonly used in the traditional machinery industry are easy to cause damage to the wafer, which is easy to warp the wafer and pollute the wafer, which has a great impact on its processing accuracy.

With the continuous evolution of semiconductor optoelectronic technology, ceramic materials have gradually become the focus of research because of their excellent physical and chemical properties

Semiconductor CMP (Chemical Mechanical Polishing) principle is a combination of chemical corrosion and mechanical grinding of the surface treatment technology, mainly used in semiconductor manufacturing and microelectronics process surface leveling.

Lithography machines are classified according to a variety of criteria such as use, light source, exposure method and degree of operational automation. Different types of lithography machines play different roles in semiconductor manufacturing, which together promote the continuous progress and development of semiconductor technology.