
A mature SPI equipment, 3D solder paste detection machine introduction
After many years of market application, this SPI detection equipment has been quite mature and efficient

Will Mini LED be the mainstream direction of future display technology? Discussion on Mini LED and Micro LED technology
Mini-LED and micro-LED are regarded as the next big vent of display technology. They have a wide range of application scenarios on all kinds of electronic devices, and are more and more popular with users, and relevant enterprises are constantly increasing capital investment.

The type and package of the chip
Integrated circuit (IC) is the cornerstone of modern electronic technology. They are the heart and brain of most circuits. They are everywhere and you can find them on almost every circuit board.

The technological impact of AI on the semiconductor industry: Changes in chip structure
Artificial intelligence has become the hottest topic now, it seems that AI can greatly change our social status quo and bring science and technology into a new era.

Nine technological innovations for the semiconductor industry in 2023
From new thermal transistors to faster semiconductor materials, these most important technological innovations are driving the semiconductor industry forward.

Semiconductor process equipment: wafer fabrication
The preparation process of wafer: turning sand into silicon wafers on which lines can be carved requires a complex and lengthy process.

Semiconductor technology and equipment: lithography technology and equipment
Lithography technology is a key semiconductor technology developed on the basis of photographic technology and flat printing technology.

Semiconductor process and equipment: thin film deposition process and equipment
Thin Film Deposition is the deposition of a layer of nanoscale film on the substrate, and then repeated processes such as etching and polishing, to make a lot of stacked conductive or insulating layers, and each layer has a designed line pattern. In this way, semiconductor components and circuits are integrated into a chip with a complex structure.

ASML's entrepreneurial Story: The Path to Growth for a lithography giant
ASML was founded on April 1, 1984 as ASM Lithography. The mission of this joint venture between Philips and ASM International is to commercialize the PAS 2000, a wafer stepper developed by Philips.

TSMC 2nm process is on track and the iPhone17 series will be the first to use
According to DigiTimes, TSMC's 2nm chip research and development work has made significant progress. This important node marks TSMC's next big step in chip manufacturing technology and will lay a solid foundation for future technological development.









