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The key technologies and equipment of integrated circuit manufacturing mainly include lithography technology and lithography equipment, film growth technology and equipment, chemical mechanical polishing technology and equipment, high-density post-packaging technology and equipment, all involve motion control technology and drive technology with high efficiency, high precision and high stability. The accuracy of structural parts and the performance of structural materials have very high requirements.

In the wafer manufacturing process, the wafer needs to be heated to a certain temperature, and the wafer temperature uniformity has a very strict requirement, because the wafer temperature uniformity has a very important impact on the quality of semiconductor chips; At the same time, it is also necessary to work in vacuum, plasma, chemical gas environments, which requires the use of ceramic heaters.

Semiconductor chips are everywhere, equivalent to the brain of electronic products, mobile phones, smart watches, computers, cars, big data, cloud computing, the Internet of things are upgraded can not be separated from it. In the semiconductor industry, advanced ceramics are the foundation of the entire semiconductor industry foundation.

Recently an exclusive interview ahead of an invitation-only event in SAN Jose, Intel outlined the new chip technologies it will offer its contract customers by sharing a glimpse of its future data center processors.

In the field of wafer foundry, TSMC has always been the industry leader, and Samsung is the second largest in the industry, but the gap between the second and the oldest is very large, TSMC's share is as high as 58.5%, and Samsung's share is only 15.8%.

The pore size of the special porous ceramic material is 2 ~ 3 microns, and it is difficult to plug with large vacuum force and partial area adsorption. It can also be used as an air floating platform, which is widely used in semiconductor, panel, laser processing and non-contact linear slider fields. Porous ceramic vacuum chuck maintain transmission by sealing air. The application of the device is limited to the flat, non-porous surface of the working platform. The user is usually the machine operator.

Fountyl Technologies PTE Ltd is an industry leading ceramic manufacturer of wafer processing equipment technology, and we are constantly optimizing and upgrading the manufacturing process of semiconductor ceramics to achieve better product quality and improve the durability of our products: high aluminum ceramic arms, robotic end effectors, ceramic wafer chucks, wafer handling and machining parts, and custom products. Please consult us directly for detailed dimensions and tolerances

Management team of Fountyl Technologies PTE Ltd has more than 20 years of semiconductor/panel /MEMS engineering experience, familiar with various materials in the industry application; With reliable materials, stable quality and high-end precision manufacturing technology as the core.

Precision ceramic materials have different processing methods according to different performance requirements. At present, the main processing methods include mechanical processing, electrical processing, supersonic processing, laser processing and composite processing. The following is a brief introduction to the machining methods of precision ceramics.

Microporous ceramics have the advantages of adsorption, permeability, corrosion resistance, environmental compatibility, biocompatibility, unique physical and chemical properties of the surface structure and are widely used in all kinds of liquid filtration, gas filtration and fixed biological enzyme carriers and biological adaptive carriers.