Leave Your Message
News

News

What is the difference between gallium nitride (GaN) and silicon carbide (SiC)?

What is the difference between gallium nitride (GaN) and silicon carbide (SiC)?

2024-05-14

Silicon has dominated the transistor world for decades. But that is changing. Compound semiconductors consisting of two or three materials have been developed that offer unique advantages and superior properties.


view detail
Principle and equipment of lithography machine

Principle and equipment of lithography machine

2024-05-13

One of the advantages of EUV is the reduction of chip processing steps, and using EUV instead of traditional multiple exposure technology will greatly reduce the steps of deposition, etching, and measurement

view detail
Japanese companies monopolize the EUV photoresist supply market

Japanese companies monopolize the EUV photoresist supply market

2024-05-13

Although there will be more photoresist manufacturers for EUV lithography. But at the moment the market is dominated by Japanese companies.

view detail
How to solve the chip package heat dissipation problem

How to solve the chip package heat dissipation problem

2024-05-12

Placing multiple chips side-by-side in the same package can mitigate thermal issues, but as companies delve further into chip stacking and denser packages to improve performance and reduce power, they're battling a new set of heat-related issues.


view detail
How can the semiconductor industry contribute to the goal of "green and low-carbon"?

How can the semiconductor industry contribute to the goal of "green and low-carbon"?

2024-05-12

The development of semiconductor technology is an important driving force for building a green and low-carbon society. At the same time, the semiconductor industry itself is actively achieving green and low-carbon, and is an active practitioner of the strategic goal of carbon neutrality.

view detail
Global wafer shortage and countermeasures

Global wafer shortage and countermeasures

2024-05-11

In recent years, the global supply and demand of wafers is unbalanced, and the shortage of 200mm wafers will continue for several years.

view detail
Progress has been made in the study of 8-inch silicon carbide single crystals

Progress has been made in the study of 8-inch silicon carbide single crystals

2024-05-11

The characteristics of high-quality crystal quality of SiC epitaxial layer make the epitaxial layer should have a crystal structure of high purity and low defect density to ensure the reliability of SiC components.

view detail
Improved gallium nitride substrate thinning technology

Improved gallium nitride substrate thinning technology

2024-05-08

Switching to a hydrogen-based plasma ensures high-speed etching of GaN substrates, and engineers at Osaka University in Japan claim to have made a new breakthrough in thinning gallium nitride (GaN) substrates using hydrogen-based plasma.



view detail
The South Korean team used IGZO to make artificial intelligence chips

The South Korean team used IGZO to make artificial intelligence chips

2024-05-10

The successful development and application of this new AI semiconductor technology shows great potential to improve the efficiency and accuracy of AI."



view detail
The application prospect of nanotechnology is very broad

The application prospect of nanotechnology is very broad

2024-05-09

IEEE experts pointed out that from solar coatings to instant rechargeable batteries, nanotechnology has a broad application prospect



view detail