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Currently, IBM, along with Samsung and the U.S. Air Force and Navy, is funding the research, which is considering the use of graphene in semiconductors and computers.

Alumina ceramics is a ceramic material with alumina (Al2O3) as the main body for thick film integrated circuits.

We have developed novel porous ceramics whose pore sizes can be made in the range of less than 1 micron to hundreds of microns. Air is drawn out through tiny pores, and the processed material is pressed against the ceramic surface. True vacuum fixation.

Recently, the world's top four semiconductor equipment manufacturers have successively announced the 2023 annual report or the latest quarterly report in 2024. Around the growth fulcrum of semiconductor equipment in 2024, technology priorities, and macro situation, the head companies have drawn these priorities.

Semiconductor industry chain is too large, semiconductor giant companies are usually through continuous acquisition or merger to enrich their product lines, so as to provide customers with a complete set of solutions.

The world's leading semiconductor companies are racing to produce 2nm chips to power the next generation of smartphones, data centers and artificial intelligence (AI).

As the core equipment of chip manufacturing, EUV lithography machine has attracted much attention, and the importance of ASML has become more and more prominent, and in this wave, the pattern of semiconductor equipment market is also quietly changing

The entire semiconductor manufacturing process is very common and indispensable, what is it used for?

What are the special requirements for the storage and transportation of wafers after they have completed all the processes in the fab? Do special environmental packaging be required?

Wafer scribing, as a key step in semiconductor manufacturing, directly affects the quality and output of the chip.