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In the public impression, the wafer is a thin, round high-purity silicon wafer, and on this high-purity silicon wafer can be processed to produce a variety of circuit component structures, so that it becomes an integrated circuit product with specific electrical functions.

With the rapid development of information technology and the growing demand for high-efficiency electronic devices, the third-generation semiconductor materials represented by silicon carbide (SiC) are gradually emerging with their advantages in band gap width, dielectric constant, thermal conductivity and maximum operating temperature.

In order to meet the growing and diversified trend of system demand, wafer-level packaging technology is constantly breaking through the direction of high density, ultra-thin, ultra-small and higher performance, at the same time, the problem of ultra-thin device wafer clamping has also put forward new demands and challenges.

Fine alumina powder through the precision processing of industrial raw materials to adapt to the application needs of different industries.

CMP (Chemical Mechanical Polishing) technology is a key process for achieving global uniform and flat wafer surfaces in semiconductor manufacturing

Ceramic forming is an important part of the ceramic preparation process, the forming technology to a large extent determines the uniformity of the body and the ability to prepare complex shaped parts, and directly affects the reliability of the material and the cost of the final ceramic parts.

Ceramic materials refer to a class of inorganic non-metallic materials made of natural or synthetic compounds by forming and sintering at high temperature. It has the advantages of high melting point, high hardness, high wear resistance and oxidation resistance. Can be used as structural materials, tool materials, because ceramics also have some special properties, but also as a functional material.

Ceramic coating is a general term for a class of inorganic non-metallic coating, which not only maintains the advantages of high temperature resistance, wear resistance and corrosion resistance of traditional ceramic materials, but also maintains the structural strength of the base material.

Wafer adsorption technology is a seemingly trivial but crucial link. Whether etched, deposited or lithographed, wafers must be stably and precisely fixed in the right position to ensure efficient chip production

Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").