Detailed introduction of five major types of semiconductor ceramic parts

What are semiconductor ceramic components?

Semiconductor device is composed of inside and outside the cavity, Most ceramics are used in chambers closer to the wafer. The important ceramic components widely used in the core equipment cavity are semiconductor equipment parts made from advanced ceramic materials such as alumina ceramics, aluminum nitride ceramics, and silicon carbide ceramics through precise processing.

The advanced ceramic materials produced by Fountyl Technologies Pte Ltd., demonstrate outstanding performance in terms of strength, precision, electrical properties and corrosion resistance, and can meet the complex performance requirements of semiconductor manufacturing in special environments such as vacuum and high temperature. Advanced ceramic material components of semiconductor equipment are mainly applied in chambers. Some of these components come into direct contact with wafers and are key precision components in integrated circuit manufacturing. They can be classified into five major categories: circular cylindrical type, airflow guiding type, load-bearing and fixed type, gripper gasket type, and module type. The specific detailed introduction is as follows:

Circular ring cylinder type

1. Mole ring: Mainly applied in thin film deposition equipment, it is located inside the process chamber and in direct contact with the wafer, serving to enhance gas guidance, insulation, and corrosion resistance.
2. The guard ring: mainly applied to thin film deposition equipment, etching machine, located in the process chamber interior, rise to protect electrostatic chuck key modules such as components, ceramic heater.
3. The edge ring: mainly applied to thin film deposition equipment, etching machine, interior cavity in process, have the effect of controlling unstable plasma escaping.

4. Focusing ring: Mainly applied in thin film deposition equipment, etching machines, and ion implantation equipment, it is located inside the process chamber, with a distance of less than 20mm from the wafer, serving to focus the plasma inside the chamber.
5. Protective cover: mainly applied to thin film deposition equipment, etching machine, interior cavity in process, have the effect of sealing and adsorption process residues.

6. Grounding retaining ring: Mainly applied in thin film deposition equipment and etching machines, it is located outside the chamber and serves to fix and support components.
7. Lining: mainly used in etching machine, located in the process chamber indoor, direction, enhance gas make the film more evenly.
8. Insulation tube: mainly used in thin film deposition equipment, etching machine, ion implantation, interior cavity in process, to improve the performance of equipment temperature control effect.
9. The thermocouple protection tube: before is mainly used in all kinds of semiconductor devices, is located in the cavity, outdoor protection thermocouple in a relatively stable temperature and the role of physical and chemical conditions.

Airflow guidance type

1. Nozzle: Mainly used in thin film deposition equipment and etching machines, it is located in the process chamber and plays a role in guiding the gas flow direction, assisting in more uniform distribution of process gases with stable flow rate, and forming the process environment.
2. Air flow distribution plate: Mainly used in thin film deposition equipment and etching machines, it is located in the process chamber and performs the function of guiding the gas flow direction, assisting in more uniform distribution of process gases with stable flow rate, and forming the process environment.
3. Restricting ring: Mainly used in thin film deposition equipment and etching machines, it is located in the process chamber and performs the function of guiding the gas flow direction, assisting in more uniform distribution of process gases with stable flow rate, and forming the process environment.
4. Diffusion plate: Mainly used in thin film deposition equipment and etching machines, it is located in the process chamber and performs the function of guiding the gas flow direction, assisting in more uniform distribution of process gases with stable flow rate, and forming the process environment.
5. Nozzle cover plate: Mainly used in thin film deposition equipment and etching machines, it is located in the process chamber and serves as the attachment component for the nozzle, and also has the function of adsorbing process residues.

Load-bearing fixed type

1. Wafer Carrier: Mainly used in thin film deposition equipment and etching machines, it is located in the process chamber and directly contacts the wafer, serving as a component for supporting the wafer and is one of the important parts for electrostatic clamps and ceramic heaters.
2. Demolding Lever: Mainly used in oxidation diffusion equipment and deposition equipment, it is located in the process chamber and directly contacts the wafer, functioning to control the wafer's rise and fall within the chamber.
3. Bearing: Mainly used in various semiconductor front-end equipment, it is located outside the chamber and plays a role in connecting and guiding the mechanical movement direction of the equipment.
4. Guide Rail: Mainly used in various semiconductor front-end equipment, it is located outside the chamber and serves the purpose of connecting and guiding the mechanical movement direction of the equipment.
5. Ceramic Screw: Mainly used in various semiconductor front-end equipment, it is located both inside and outside the chamber, functioning to connect and fix, replacing metal components, and providing corrosion resistance and oxidation resistance.
6. Ceramic Cap: Mainly used in various semiconductor front-end equipment, it is located both inside and outside the chamber, serving the purpose of connecting and fixing, replacing metal components, and providing corrosion resistance and oxidation resistance.

Claw gasket type

1. The mechanical arm: before is mainly used in all kinds of semiconductor devices, is located in the cavity, cavity outdoor, indoor, direct contact with the wafer wafer in the cavity of indoor and outdoor transmission effect.
2. Insulated parts: before is mainly used in all kinds of semiconductor devices, is located in the cavity indoor, outdoor, cavity prevent current conduction, some also play the role of adiabatic function.
3. Heat sink: before is mainly used in all kinds of semiconductor devices, interior cavity in process, have the effect of cooling equipment parts.

Modules

1. Vacuum chuck: Mainly applied in etching equipment, they are located inside the process chamber and in direct contact with the wafers. The chuckattract the wafers through vacuum pumping and maintain their flatness. at the same time, they control the temperature through water pipelines to optimize the process reaction effect.
2. Ceramic heater: mainly applied to thin film deposition equipment, laser annealing equipment, interior cavity in process, direct contact with the wafer and wafer to carry and get stable and uniform process temperature and the effect of film forming conditions.
3. Electrostatic chuck: Mainly applied in etching equipment and some thin film deposition equipment, it is located in the process chamber and in direct contact with the wafer, playing a role in electrostatic adsorption of the wafer to complete the etching, deposition and other process reactions.
4. Ultra-high purity silicon carbide kit: It is mainly applied in oxidation diffusion equipment, located in the process chamber, in direct contact with the wafer part, providing support and uniform heat source for wafer placement, and maintaining mechanical strength in a high-temperature environment above 1,000℃.

Fountyl Technologies Pte Ltd. is focusing with 20 years of the semiconductor industry experience of advanced ceramic parts manufacturing in Singapore, main products are silicon carbide wafer pin chuck, porous ceramic chuck, ceramic end effector, ceramic beam, ceramic guide and precision ceramic parts which made of various kinds of ceramic materials(alumina,zirconia,silicon carbide, silicon nitride, aluminum nitride and porous ceramics), fully independent control of ceramic material sintering, precision processing, testing, and precision cleaning, with guaranteed delivery time. Products are exported to the United States, Europe and Southeast Asia , more than 20 countries and regions.