Integrated circuit manufacturing process

2024-08-08

The manufacture of integrated circuit is the process of constructing the designed circuit diagram on the prepared silicon wafer through many complex processes, and finally conducting the sealing test. This process requires upstream industrial chains such as semiconductor materials, equipment, and clean engineering as support.

1, IC design

The process of realizing specific functions through logic circuit design. The customer proposed the design to the IC design engineer, and cooperated to complete the design of the logic circuit, the design drawing was converted into a circuit diagram, and the software test verified whether it met the customer's needs, and finally the circuit diagram was made in the form of a light mask for the next manufacturing use. The whole process is mainly done in the computer, involving very little equipment, mainly mask production: mask platemaking machine.

2, IC manufacturing

IC manufacturing is divided into two parts: wafer manufacturing and wafer processing.

Wafer fabrication: The process of making monocrystalline silicon wafers using silicon dioxide as a raw material. Industrial grade silicon is obtained by REDOX reaction of SiO2 with carbon, and trichlorosilane is obtained by reaction of industrial grade silicon with hydrochloric acid. The purity of trichlorosilane is more than 9 by distillation many times, and finally, high-purity polysilicon is obtained by reduction reaction of ultra-high-purity hydrogen. The production process of monocrystalline silicon wafer is: crystal pulling - rolling - wire cutting - chamfering - grinding - corrosion - heat treatment - edge polishing - front polishing - cleaning - detection - epitaxy and other steps, in which crystal pulling, grinding and polishing is the key to ensure the quality of semiconductor silicon wafer. This process involves the main equipment: reduction furnace, single crystal furnace, rolling mill, slicer, chamfering machine, grinding equipment, CMP polishing machine, cleaning equipment, testing equipment, etc.

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Wafer processing: refers to the process of making logic circuits on wafers, carrying out diffusion, deposition, photolithography, etching, ion implantation, polishing, metallization and other operations on silicon wafers, which are carried out in the wafer clean workshop. The equipment involved are diffusion furnace, PVD/CVD equipment, lithography machine, gluing machine, gluing developer, etching machine, ion implantation equipment, CMP equipment, electroplating equipment, etc.

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3, IC encapsulation

The process of thinning, cutting, mounting, bonding, packaging, and testing wafers. Advanced packaging equipment and packaging technology are closely linked together. The equipment involved are thinning machine, scribing machine, bonding machine, probe table, placement machine, cleaning equipment and so on.

Package = chip + protective shell + external circuit connection + mechanical support

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