Introduction to 10 Forming Methods of Semiconductor Ceramic Components

2025-05-05

Mr. David from FOUNTYL TECHNOLOGIES PTE. LTD. Introduces to you: With the progress of science and technology, mobile phone, computer, intelligent product and so on electric car, robot into the life of people, the products have a large semiconductor chip, chip preparation need to semiconductor devices, such as etching machine, printing machine, ion implantation machine, etc. When opening semiconductor equipment, most of the components inside are ceramic parts. Ceramic parts have excellent properties such as high temperature resistance, corrosion resistance, high precision and high strength, and can be well used in semiconductor equipment. Most ceramic components, as key parts of equipment in semiconductor manufacturing processes, come into direct contact with wafers, enabling high-precision control of wafer surface temperature and rapid temperature rise and fall.

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Semiconductor ceramic components belong to advanced ceramics, and the ceramic materials involved usually include alumina, silicon carbide, aluminum nitride, silicon nitride, yttrium oxide, etc. The forming methods of ceramic products usually include dry pressing, casting, injection molding, hot isostatic pressing, cold isostatic pressing, grouting, extrusion, hot die casting, gel injection molding, direct solidification injection molding and many other methods.

1. Dry pressing molding is dry pressing molding manufacture a kind of common technology of semiconductor devices. This process mainly involves pouring the powder with an appropriate particle size distribution after granulation into a metal mold cavity, applying pressure to it with a press head. The press head moves within the mold cavity and transmits the pressure to the powder particles in the mold, allowing them to be compacted. Eventually, a ceramic green body product with a certain shape and strength is formed.

2. Stretch forming flow forming technology is a kind of to produce a forming thickness from dozens of micron to millimeter scale wet forming technology of the ceramic blank. The ceramic slurry with certain viscosity and good dispersibility flows from the blade opening of the slurry tank of the cast film machine onto the base band. The slurry is then spread out. Under the action of surface tension, a smooth upper surface green mold is formed. The green mold along with the base band is sent to the drying chamber. After the solvent evaporates, the organic binder forms a network between the ceramic particles, thereby generating green pieces with certain strength and flexibility. After peeling the dried green pieces from the base band, the reel is set aside. Then, according to the needs, the product undergoes processes such as cutting, stamping and piercing, and is fired to complete the processing of the product.

3. Injection molding injection molding is a new kind of manufacturing technology of ceramic parts, the main production process is divided into: the preparation of injection material, injection molding, debinding and sintering four links. It is often used to prepare small ceramic components with complex geometric shapes and special requirements.

4. The isostatic pressing molding isostatic pressing molding including hot isostatic pressing and cold isostatic pressing molding. Isostatic pressing can transfer pressure from all directions, thereby ensuring the densification of the sheet metal.

1) hot isostatic pressing process is under high temperature and high pressure, the atoms diffusion ability, make the pores migrated to grain boundary in the ceramic or surface, to reduce and eliminate the role of porosity. The hot isostatic pressing process, through thin-walled prestressed winding units, enables uniform and rapid cooling. Compared with the natural cooling process, the production efficiency is greatly improved.

2) cold isostatic pressing technology this method at room temperature or slightly high temperature (< 93 ℃) on ceramic or metal powder under the condition of high 100 ~ 600 mpa, resulting in "green", and its sintering to ultimate strength.

5. Grouting molding grouting process is widely used for ceramic mass production a molding method. It involves injecting slurry with a high solid content and good fluidity into a porous gypsum mold. Due to the capillary suction force of the porous template, the inner wall of the template will absorb water from the slurry and then form a solidified green body along the mold wall. Once the green body reaches a certain strength, it can be demolded.

6. Extrusion extrusion is the ceramic powder, clay or organic adhesives, water blending, mixing, many times after vacuum degassing, stale, make extrusion billet has good plasticity and uniformity. Then, under the action of the extrusion screw or plunger, the product is extruded from the die at the extruder nozzle, thereby obtaining the product of the required shape.

7. Die-casting molding hot die-casting molding process, the main use of paraffin wax heating melt, encounter cold coagulation, the characteristics of the ceramic powder and hot wax liquid mixed evenly, can form a kind of flow of slurry. Under certain pressure, the slurry is injected into the metal template for shaping. After the wax slurry cools and solidifies, the mold is removed to take out the already formed green body. The green body is trimmed, then subjected to high-temperature dewaxing, and finally sintered to form the finished product.

8. Gel is gel injection molding, injection molding molding molding in the solution containing organic matter, the ceramic powder is dispersed, preparation of high solid suspension. Then, the suspension is injected into a mold of a certain shape. Under certain catalytic and temperature conditions, the organic monomers undergo polymerization - gel formation - in-situ solidification of the suspension - drying, and thus a green body with higher strength can be obtained.

9. Direct coagulation, injection molding molding direct injection molding molding is a new kind of ceramic net size colloidal molding method. This method combines traditional ceramic techniques with chemical theories, using catalysts or initiators to cause the organic monomers added to the suspension to undergo cross-linking and form a network structure, thereby leading to in-situ curing.

FOUNTYL TECHNOLOGIES PTE. LTD. Our team members have 20 years of experience in the semiconductor precision ceramics industry. Our main products include PIN needle chucks, multi-hole ceramic vacuum chucks, ceramic robotic arms, ceramic air-floating guide rails, and ceramic square beams. The material properties meet the requirements of the semiconductor industry, and effective testing standards ensure high precision. For technical communication, please email David@fountyltech.com and we will reply within 3 working days.