Introduction to Ceramic Parts in Semiconductor Components
Ceramic materials, as an important type of composite material system, typically consist of a mixed system composed of various compounds such as alumina (Al₂O₃), silicon nitride (Si₃N₄), and zirconia (ZrO₂). Through strict formula design and component regulation, precise control of material performance parameters can be achieved. In the field of semiconductor equipment manufacture, this kind of material is mainly used in mechanical seal ring (such as silicon carbide ceramics), insulation support components (such as aluminum nitride ceramic), and wear resistant liner key components (such as zirconia ceramics). It is worth noting that the production and quality control of high-end ceramic materials must strictly follow international standards and specifications such as ASTM F2091.
Fountyl Technologies Pte Ltd. focusing on providing the ceramic vacuum chuck, ceramic arms, ceramic beams, ceramic guides and various of precision ceramic components for the semiconductor industry, which have received high praise from users.
Advanced ceramics have strict requirements
Semiconductor equipment manufacturing, the industrialization of advanced ceramic components application must meet the following three dimensions of strict requirements:
1. Material performance indicators: They must fully meet the comprehensive performance requirements of semiconductor equipment for materials in terms of mechanical strength, thermal properties, dielectric characteristics, and chemical corrosion resistance (including acid and alkali media and plasma environments).
2. Precision machining technology: because of the advanced ceramics, belongs to the typical hard brittle difficult-to-machine materials and semiconductor equipment on the parts size accuracy and surface quality requirement is very strict, processing technology has always been the key technology of ceramic parts in the field of semiconductor application bottlenecks;
3. Surface treatment: in view of the semiconductor devices in the ceramic parts are usually in the core area of the wafer processing, parts and even direct contact with the wafer, so on the surface of metal ion concentration and micro particle pollution control standard strict abnormal, which makes the processing after the surface treatment technology is key to ceramic components of the applicability of one of the core elements.
Introduction to main ceramic materials
Ceramic materials used in semiconductor equipment mainly include systems such as alumina, silicon nitride, aluminum nitride and silicon carbide, among which precision ceramic components account for approximately 16% of the total value of the equipment. Advanced ceramic materials for various semiconductors all possess unique performance characteristics and specific application fields. The following will provide a detailed elaboration on the main material systems and their applications:
In alumina (Al ₂ O ₃), silicon carbide (SiC), aluminum nitride (AlN) as the representative of advanced ceramic materials, because of its high hardness, excellent wear resistance, excellent corrosion resistance, low thermal expansion coefficient and high insulation features, can perfect adaptation in the process of semiconductor manufacturing high temperature, strong corrosion and high precision environmental requirements.
The specific application advantages are reflected in the following aspects:
1. Resistance to plasma corrosion: In etching and chemical vapor deposition (CVD) equipment, ceramic components (such as focus rings, chamber linings, etc.) need to be exposed to high-energy plasma environments containing fluorine or chlorine for long periods. The chemical inertness of ceramic materials makes their performance in this field significantly superior to that of traditional metal materials.
2. Thermal stability: Taking silicon carbide as an example, its high thermal conductivity and low thermal expansion coefficient make it an ideal choice for components with strict requirements for nanometer-level motion accuracy, such as the workpiece stage of a photolithography machine.
3. Cleanliness control: The low contamination characteristics of ceramic materials (such as aluminum oxide vacuum chucks) can effectively prevent metal particle contamination during wafer processing, ensuring the purity of the process.
Main ceramic materials and their typical applications
SiC
The low reactivity and conductivity of CVD silicon carbide to chlorine and fluorine-containing etching gases make it an ideal material for components such as the focusing ring in plasma etching equipment. According to QY Research data, global CVD silicon carbide parts market revenue in 2022 reached $813 million, is expected to reach $1.432 billion in 2028, the compound annual growth rate (CAGR) of 10.61%.
Grinding discs: Compared with traditional metal grinding discs, silicon carbide ceramic grinding discs can significantly reduce surface damage to wafers and improve grinding efficiency at the same time.
Reaction cavity parts: such as vertical boat, thermal cutoff, etc., are widely used in the high temperature heat treatment equipment, such as oxidation furnace, rapid annealing equipment, etc.).
Lithography machine parts: silicon carbide workpiece and ceramic side mirror with lightweight and high stability advantages, is widely used light engraving machine precision motion systems.
Etching equipment: focus ring, gas spray top to tolerance of the key parts in plasma etching.
Al₂O₃
Etching machine protection: High-purity alumina coating or bulk ceramics are used for the inner lining of the etching chamber, significantly extending the service life of the equipment.
Electrostatic chuck (ESC): Based on Coulomb force to adsorb wafers, alumina has become the mainstream material due to its high cost performance, but aluminum nitride (AlN) is gradually replacing some of its applications due to its superior thermal conductivity.
Robotic arms and nozzles: Ceramic robotic arms used for wafer handling and gas nozzles for plasma cleaning equipment need to meet strict requirements such as high wear resistance and corrosion resistance.
AlN
High-quality aluminum nitride powder is a prerequisite for obtaining high thermal conductivity aluminum nitride ceramic substrates. Currently, the preparation technology of high-end AlN powder is basically monopolized by developed countries such as Japan, the United States, and Germany, and they strictly impose technological blockades. Their AlN powder has the advantages of high purity, good particle size uniformity, good sintering performance, and good shrinkage consistency, occupying 90% of the global market share, especially by industry giants such as Tokuyama and Toyo Aluminum in Japan.
Electrostatic chuck: Compared with alumina, the high thermal conductivity of aluminum nitride can significantly improve the precision of wafer temperature control, but due to its relatively high cost, its application is still concentrated in high-end fields.
Heat dissipation components: As a heat dissipation substrate for high-power devices (such as RF power modules), it fully exploits its excellent thermal conductivity performance.
Si₃N₄
Bearings and guide rails: With high strength and thermal shock resistance, they are widely used in the precision motion systems of photolithography machines and etching machines.
The special structural ceramics produced by Fountyl Technologies include silicon nitride ceramics, aluminum nitride ceramics, alumina ceramics, silicon carbide ceramics and porous ceramics. They are made from high-purity ceramic raw materials and formed through dry pressing or cold isostatic pressing, high-temperature sintering and precision processing. The ceramic structural components manufactured by Fountyl have many characteristics such as high temperature resistance, corrosion resistance, wear resistance and insulation.
Market Analysis of Semiconductor Ceramic Products
According to the latest research data from QYResearch, the global market size of semiconductor ceramics and key materials was approximately 2.766 billion US dollars in 2024 and is expected to grow to 4.257 billion US dollars by 2031, with a compound annual growth rate (CAGR) of 6.8% during the period from 2025 to 2031.
At present, the global semiconductor ceramic materials market is about $18 billion to the high-end market, such as ceramic heater, electrostatic chuck, etc.) of localization rate is still less than 10%, mainly by Japanese Kyocera (Kyocera), such as the United States CoorsTek international giant monopoly.
Japanese companies occupy the dominant position in the global market, the market share of more than 50%. Among them, Kyocera, NGK, Ferrotec, TOTO, Niterra and Japan Fine Ceramics Co., Ltd. (JFC) are leading in technology in the field of high-end components (such as silicon carbide lithography machine worktables); CoorsTek of the United States has a significant advantage in the field of corrosion-resistant ceramic coatings.
