Porous Ceramic Vacuum Chuck for 8” & 12” Wafers | High Precision Semiconductor Chuck
High-Precision Porous Ceramic Vacuum Chucks
Porous ceramic vacuum chucks are advanced wafer handling platforms designed for semiconductor manufacturing, precision optics, MEMS fabrication, and thin-film processing.
Built with a micro-porous ceramic structure, the chuck provides uniform vacuum distribution, ultra-high flatness, and particle-free operation.
It is optimized for 8-inch and 12-inch wafer processing systems and supports OEM customization.
Key Features of Porous Ceramic Vacuum Chucks
Uniform Vacuum Distribution for Wafer Stability
The micro-porous structure ensures even suction across the wafer surface, reducing stress concentration and deformation.
Ultra-High Flatness for Precision Semiconductor Processes
Precision lapping and sintering achieve micron-level flatness for advanced lithography systems.
Cleanroom-Compatible Particle-Free Design
Porous ceramic generates minimal particles compared with metal vacuum chucks.
High Thermal & Chemical Resistance
Stable performance in high-temperature and plasma environments without deformation.
Fully Customizable OEM Design
Vacuum zoning, pore size, groove patterns, thickness, and connectors are customizable.
Technical Specifications
| Specification | Details |
|---|---|
| Material | Porous alumina / silicon carbide ceramic |
| Wafer Compatibility | 8 inch / 12 inch |
| Flatness | ≤ 5 μm (customizable ) |
| Porosity | 30% – 45% |
| Pore Size | 2 – 50 μm (customizable) |
| Vacuum Uniformity | ±3% |
| Operating Temperature | Up to 800°C |
| Chemical Resistance | Acids, alkalis, plasma |
| Custom Options | Vacuum zoning, groove design, interface type |
Applications in Semiconductor & Precision Industry
Porous ceramic vacuum chucks are widely used in semiconductor lithography, wafer dicing, thin-film deposition, MEMS manufacturing, optical alignment, and precision bonding systems.多孔
Why Choose Porous Ceramic Over Metal Chucks?
Compared with aluminum or stainless steel vacuum chucks, porous ceramic offers better vacuum uniformity, lower particle contamination, higher thermal stability, reduced wafer warping, and longer service life.
Customization & OEM Services
We provide full customization including wafer size, vacuum zoning, groove design, material selection, interface structure, and mechanical integration.
Frequently Asked Questions (FAQ)
What is a porous ceramic vacuum chuck used for?
Used for wafer holding and positioning in semiconductor processes.
Can it be customized?
Yes, OEM/ODM customization is fully supported.
Is it suitable for high-temperature processes?
Yes, up to 800°C depending on material.
Does it generate particles?
Minimal particle generation due to ceramic structure.
What wafer sizes are supported?
Standard 8” and 12”, custom sizes available.











