Leave Your Message
2024 Development of Taiwan's semiconductor industry

News

2024 Development of Taiwan's semiconductor industry

2024-09-20

The total revenue of Taiwan's semiconductor industry in 2023 is NT $3.77 trillion, accounting for more than 20% of the global total. Looking forward to 2024, the development of Taiwan's semiconductor industry is still optimistic, mainly because AI drives the growth of demand for high-end mobile phones, AI PCS and related hardware, which in turn drives the production capacity of IC manufacturing in Al and HPC advanced processes, and seal test companies are therefore increasing capital expenditure, strengthening chip heterogeneous integration and high-level packaging technology to meet the end applications of edge AI. It is estimated that Taiwan's semiconductor industry will reach NT $5.113.4 billion in 2024, with an annual growth rate of 17.7%

 

Taiwan's IC design industry has a positive impact on the market due to a series of factors such as the gradual warming of the mobile phone market, strong growth in demand for high-end mobile phone chips, and computer upgrades driven by AI PCS. Coupled with slowing inflation, the annual output value of Taiwan's IC design industry is estimated to reach NT $1.2617 trillion in 2024. An increase of about 15.1% from 2023.

 

Taiwan's IC manufacturing industry is estimated to have a full-year output value of NT $3 trillion 2014 in 2024, up 20.2% from 2023. Among them, the foundry industry is expected to grow 20.1 percent to NT $2.9932 trillion. Mainly driven by Al and HPC demand, the output of advanced process nodes such as 3 nm will also continue to increase. In terms of memory and other manufacturing industries, it is estimated that the DRAM market will remain stable, mainly benefiting from the AI PC trend, driving memory demand to increase, looking forward to 2024 DRAM prices to maintain an upward trend, and it is estimated that the output value of memory-related products will grow by 22.4% in 2024, which is NT $208.2 billion.

 

Taiwan's IC sealing industry is due to Al's demand for high-speed computing to drive the development of advanced packaging technology, the relevant sealing and testing industry will strengthen the deployment of heterogeneous integration of high-level packaging capacity, while the terminal consumer demand to win, IC sealing and testing industry output value is expected to rise quarter by quarter. Overall, driven by the heterogeneous integrated packaging technology in place and the high demand for AI applications, it is estimated that the output value of Taiwan's IC sealing and testing industry in 2024 will be NT $6500.3 billion, an increase of 11.4% over 2023.

 

In terms of manufacturing capacity distribution, in 2023, China's Taiwan IC manufacturers accounted for 86% of the production capacity in Taiwan, and 14% outside the island. Among them, from the geographical distribution of the island, the capacity distribution of northern, central and southern Taiwan is 47%, 14% and 39%, respectively. The South leads with 54% of capacity, ahead of 27% in the north and 19% in the centre. This shows that southern Taiwan is the main concentration area of semiconductor manufacturing, with a relatively complete industrial chain and production facilities.​​

 

The existing production capacity outside the world's advanced islands in Singapore accounts for about 20%, and the domestic production capacity accounts for 80%; The current production capacity of LDC is in Taiwan, China, that is, 100% of the production capacity on the island.

 

The specific distribution of Taiwan's major manufacturers' off-island production capacity is as follows:

①TSMC Songjiang 8-inch Wafer Fab in Shanghai, China, Nanjing 12-inch wafer Fab in Nanjing, Singapore SSMC 8-inch wafer Fab in Singapore, World Advanced 12-inch wafer Fab in Singapore, Kumamoto 12-inch wafer Fab in Japan (under planning), Dresden 12-inch wafer Fab in Germany, Seattle 8-inch wafer Fab in Seattle, Arizona 12-inch wafer Fab in Arizona, USA

②UMC Suzhou Hejian 8-inch Wafer Fab, Xiamen Lianxin 12-inch Wafer Fab, Singapore 12-inch wafer Fab, Mi Prefecture 12-inch wafer Fab, Japan

③LICC Nicheng 12-inch Wafer Fab, Doreira 12-inch wafer Fab, Gujarat, India

④ASE Seal test China Shanghai Material Factory, China Shanghai Moon Core Technology test factory, China Wuxi factory packaging and testing, South Korea factory packaging and testing, Japan factory packaging and testing, Malaysia factory packaging and testing, Singapore factory packaging and testing, ISE Labs test

⑤Silicon product packaging and testing in China Suzhou factory, Malaysia factory, the United States factory。

 

In Taiwan Island, The main plant areas of TSMC are distributed as follows:

①The back section of Taoyuan Plant is sealed and tested, and 3 plants are sealed and tested (InFO base camp, the acquisition of the former Qualcomm Longtan Plant);

②At 12 o 'clock in Hsinchu Plant, Plant 12A (45 nm ~0.13 microns), Plant 12B (7/6/5 nm, advanced process trial production), and Plant 20 (2 nm) in Baoshan are under construction; At 8:00, Plant 3, Plant 5, Plant 8 at 6:00, Plant 2; The last section is sealed and tested, and 1 plant is sealed.

③The rear section of Miaoli Plant is sealed and tested, and the sealed and tested plant 6 (3DFabric) and the Tongluo Plant are expected to produce 2Q27; ④ At 12:00 in the Taichung plant, Plant 15A (28 nm), Plant 15B (7/6 nm); The last section is sealed, and 5 plants are sealed.

④ At 12:00 in the Taichung plant, Plant 15A (28 nm), Plant 15B (7/6 nm); The last section is sealed, and 5 plants are sealed.

Tainan factory
At 12:00, Plant 14A (45 nm), 14B (12/16 nm), 18A (5/4 nm), 18B (3 nm);
8 o 'clock, 6 factories;
The rear section is sealed, and the second plant is sealed.

⑥ Advanced process factory situation
2nm: TSMC is planning to build new 2nm plants in Hsinchu Science Park and Nanzi Park in Kaohsiung, Taiwan, China, of which the first has broken ground and plans to move into the first machine by January 2025; The second fab is expected to start construction soon.

1nm: According to TSMC's previously announced roadmap, 1.4nm class A14 and 1nm class A10 manufacturing processes are expected to achieve mass production between 2027 and 2030.

 

Fountyl Technologies Pte Ltd., is focusing with 20 years of the semiconductor industry experience of advanced ceramic parts manufacturing in Singapore, main product is wafer pin chuck, ring groove chuck, porous ceramic chuck, ceramic end effector and ceramic beam&guide which made of various kinds of ceramic materials(alumina,zirconia,silicon carbide, silicon nitride, aluminum nitride and porous ceramics),fully independent control of ceramic material sintering, precision processing, testing, and precision cleaning, with guaranteed delivery time. Products are exported to the United States, Europe and Southeast Asia , more than 20 countries and regions.