Semiconductor English Terminology
semiconductior
elemental semiconductor
compound semiconductor
conductivity type
n-type semiconductor
p-type semiconductor
hole
accepter
donor ['dəunə]
caeeier
carrier concentration
majority carrier
minority carrier
impurity concentration
deep-level impurity
recombination center
compensation
depletion layer
infrared absorption spectrum
infrared absorption coefficient
resistivity(bulk)
conductivity
allowable resistivity tolerance
radial resistivity variation
sheet resistance
spreading resistance
two point probe
four point probe
mobility
hall effect
hall coefficient
hall mobility
lifetime
anisotropic
crystallographic
notation
miller indices
Laue method
crystallographic direction
crystallographic plane
off-orientation
orthogonal misorientation
primary flat
secondary flat
cleavage plane
epitaxial layer
diffused layer
buried layer
layer boundary
interface
p-n junction
bipolar devices
integrated circuit
crystal
ingot
polycrystalline semiconductor
twinned crystal
single crysal
zero D single crystal
substrate
chemical vapor deposition (CVD)
epitaxy
vapor phase epitaxy (VPE)
liquid phase epitaxy (LPE)
molecular beam epitaxy(MBE)
homoepitaxy
heteroepitaxy
sputtering method
doping
heavy doping
ion implanation
autodoping
compensation doping
neutron transmutation doping (NTD)
dopant
vertical pulling method( Czochralski growth)(cz)
floating zone method (FZ)
horizontal crysal growth method
magnetic field Czochralski growth(MCZ)
gettering
cutting
lapping
etching
isotropic etching
anisotropic etching
preferential etching
Chem-Mech polishing
polished surface
front side
back side
slice
doping wafer
diameter
thickness
thickness of slices
allowable thickness tolerance
total thichness variation (TTV)
median surface
bow
warp
flatness
fixed quality area(FQA)
linear thickness variation(LTV)
nonlinear thickness variation(NTV)
edge crown
edge rounding
chip
indent
saw marks
saw exit marks
scratch
macroscratch
microscratch
groove
waves
dimple
probe damage
residual mechanical damage
bright point
imbedded abrasive grain
crack
fracture
crows‵
feet
crystal defect
block structure
point defect
dislocation
dislocation density
stacking fault
fault
oxidation induced stacking fault(OSF)
slip
slip line
grain boundary
low-angle grain boundary
dislocation array
lineage
star structure
inclusion
microdefect
precipitates
impurity concentrating
piping
turret network
striation
swirl resistivity striation
temperature circle
oxide lamella
haze
oringe peel
mound
pyramid
spike
contaminant
dirt mark
smudge chuck mark
particulate
solvent residue
wax residue
spot
stain
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