Wafer chuck
ESC uses electrostatic force to firmly fix the wafer or substrate in the vacuum environment of the processing equipment. This method eliminates the potential damage associated with traditional mechanical clamping methods, which may scratch fine surfaces or induce stress fractures. Unlike vacuum chuck, ESC does not rely on pressure difference, thus achieving greater control and flexibility in wafer processing.

The 7 major benefits of using E-Chuck:
1. Non-mechanical clamping: The E chuck offers a unique method of fixing objects by using electrostatic force, without the need for physical pressure as in traditional mechanical fixtures. This innovative non-mechanical clamping method not only protects fragile materials but also maintains contact without the need for bulky clamping mechanisms, thus saving valuable space.
2 Uniform clamping force: E chuck in the entire surface of the object to provide a consistent and stable clamping force, to ensure safety grip and stability. Their ability to evenly flatten wafers is extremely outstanding, surpassing the performance of vacuum fixtures, which usually have difficulty achieving a flat surface. This uniformity is crucial for maintaining the integrity and flatness of the substrate throughout the manufacturing process.
3. Temperature control: Another significant advantage of electrostatic suction cups is that they can control the temperature during the manufacturing process. The E chuck uses electricity to heat or cool the substrate as needed. This ability ensures the best processing conditions and reduces the thermal stress of sensitive materials.
4: Versatility: chuck E has a strong adaptability, suitable for all kinds of materials, shapes and sizes. Whether it is for fixing semiconductor wafers, flat panel displays or fabric materials, electronic chucks can provide multi-functional clamping solutions.
5 Reduce particle pollution: E chuck without physical contact with the object, thereby minimizing risk of particle pollution in the clean room environment. This ability is crucial in semiconductor manufacturing, as even tiny particles can affect the performance and yield of chips.
6 Improve productivity: E chuck by providing security and stability of the clamping to help increase in industrial productivity. Their precise control and reliability minimize downtime caused by material handling errors to the greatest extent. Therefore, the electric chuck offers higher efficiency.
7 Cost-effectiveness: Although the initial investment required for the E chuck is higher than that of traditional mechanical fixtures, its long-term cost-effectiveness is very excellent. compared with vacuum chuck, they significantly reduce material waste, increase process output, and have lower maintenance costs. In addition, the combination of monitors and sensors provides real-time performance data for operators, thereby improving maintenance plans and operational efficiency.

01/ Low leakage chuck
02/ High and low temperature chucks
03/ High-voltage and high-current chuck
04/ Fine-hole chuck
05/ Quick replacement of top disc chucks
06/ Temperature Control System
07 / Customized new Type of packaging chuck
A multi-channel precise temperature control test solution for advanced chip packaging
◆Design of a complete set of test solutions
◆Provide simulation analysis of the scheme
◆Test technical support
08/ Customized chuck for laser resistance repair equipment
Customized chucks for resistance repair equipment
◆Leakage current 0.00001 mA
◆Multi-channel temperature control accuracy±1 ℃
◆Operating temperature: Room temperature to 150℃

09/ Customized chuck for film inspection equipment
Customized chucks for film inspection equipment
◆Provide 485 communication
◆The multi-channel temperature control accuracy is ±1℃
◆Operating temperature: Room temperature to 150℃
10/ Other types of customized design
Provide various chuck design services
◆Professional equipment and material analysis
◆Three-dimensional data measurement
◆Model simulation analysis
11/ Chuck processing service
Provide various chuck processing services
◆Professional equipment and material analysis
◆Analysis of surface materials for professional equipment
◆High-precision detection equipment
◆Five-axis metal processing equipment, surface grinding equipment, PVD coating, etc
◆Behavioral dimension processing such as flatness and parallelism
◆Surface roughness and gloss treatment
◆Surface coating refurbishment
◆Heating plate maintenance
FOUNTYL TECHNOLOGIES PTE. LTD. was located in singapore, specialized at ceramic material forming, sintering & machining technology, serving semiconductor users, products are silicon carbide chuck, porous ceramic vacuum chuck, air floating table, ceramic end effector and ceramic guide rail, welcome to contact us for further potential business cooperation.










