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Ceramic structural parts (ceramic parts)

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Zirconia used for wear resistant parts, heat resistant parts

Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields

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Semiconductor manufacturing process is the process of processing silicon wafers into semiconductor chips. It can be roughly divided into front segment and back segment.

10 common wafer industry terms

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Leading Press Free Sintered Silicon Carbide Exporter

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