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Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

AISiC Parts

Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

Both the performance advantages of aluminum alloy and ceramic materials, but also effectively avoid the performance shortcomings of a single material, in aviation, aerospace, Marine ships, rail transit, new energy vehicles and other high-tech fields have a wide range of application prospects.


Material characteristics: high specific stiffness, high specific strength, high dimensional stability, low thermal expansion coefficient, good wave absorption, high wear resistance, corrosion resistance...etc.

    Comparison of properties of AISIC with traditional metal and ceramic materials:

    aluminium alloy(7050) titanium alloy(TC4) stainless stee(SUS304) SIC Alumina AISiC
    Density(g/cm3) 2.8 4.5 7.9 3.2 3.97 2.8-3.2
    Strength of extension(MPa) ≥496 ≥985 ≥520 - - 270-450
    Elasticity modulus(Gpa) 69 110 210 330 300 160-280
    Bending strength(Mpa) - - - 350-600 290 230-450
    Coefficient of linear expansion(×10/℃) 24 8.6 17.3 4.5 7.2 4.5-16
    Thermal conductivity (W/m·K) 154-180 8 15 126 20 163-255


    The medium and high body aluminum silicon carbide composite materials we adopted on new type workmanship preparation with no interface phase, which effectively avoids the shortcomings of the brittleness of the metal ceramic composite materials, and greatly improves the processing performance and application range of the materials.

    1. Aluminum silicon carbide - structural parts
    High-strength precision structural parts - with the characteristics of lightweight, high stiffness, dimensional stability, wear resistance and corrosion resistance, instead of aluminum alloy, stainless steel, titanium alloy, used in high-precision, wear-resistant structural parts with counterweight requirements.


    Performance parameters of high volume AISiC composites


    Density(g/cm3) Bending strength(MPa) Modulus of elasticity(GPa) Rate of elongation(%) Damping ratio(ζ,%) Thermal conductivity(W/m·K)@25℃ Coefficient of linear expansion(×10/℃) 25-200℃
    S45 SiC/AI 2.925 298 172 1.2 0.42 203 11.51
    S50 SiC/AI 2.948 335 185 / 0.52 207 10.42
    S55 SiC/AI 2.974 405 215 / 0.66 210 9.29
    S60 SiC/AI 2.998 352 230 / 0.7 215 8.86


    Product advantages: light weight, high stiffness, good dimensional stability, high and low temperature cycle is not easy to deform, can process complex, thin-wall structure, small size precision holes, whorl


    2. Aluminum silicon carbide - heat dissipation part
    Microelectronic cooling substrate/shell: aluminum silicon carbide is known as the third generation of electronic packaging materials for its superior thermal physical properties, and is widely used in the field of electronic packaging (the first generation such as aluminum, copper; The second generation such as Kewa, copper molybdenum, copper tungsten alloy....etc).


    Density(g/cm) Bending strength(MPa) Modulus of elasticity(GPa) Thermal conductivity(W/m·K) @25℃ Coefficient of linear expansion(×10°/℃) 25-200°℃
    T60SIC/AI 2.998 260 229 220 8.64
    T65SIC/AI 3.018 255 243 236 7.53
    T70SIC/AI 3.05 251 258 217 6.8
    T75SIC/AI 3.068 257 285 226 5.98


    Product advantages: High thermal conductivity, surface function diversified design, Low thermal expansion coefficient (similar to the thermal expansion coefficient of the chip material) Low welding porosity.

    IGBT package base plate: The thermal conductivity of aluminum silicon carbide is high and low thermal expansion coefficient (thermal expansion coefficient is similar to the chip material), effectively reduce the probability of package circuit cracking, improve the service life of the product. In high-speed rail, new energy vehicles, radar, wind power generation to replace aluminum, copper, copper tungsten, copper molybdenum, beryllium, ceramics and other microelectronics packaging materials.


    Comparison of performance parameters of AISIC and other packaging materials


    Materials Density (g/cm*) Coefficient of linear expansion(x 10°/ ° C) Thermal conductivity (W/m·K) Specific stiffness(Gpa cm/g)
    AISIC 2.8-3.2 4.5-16 163-255 76-108
    Cu 8.9 17 393 5
    AI (6061) 2.7 23 171 25
    Kovar 8.3 5.9 14 16
    Invar 8.1 1.6 11 14
    Cu/Mo(15/85) 10 7 160 28
    Cu/W(15/85) 17 7.2 190 16