Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

High temperature resistance: Silicon carbide and alumina ceramic materials have excellent high temperature performance, can be used in high temperature environment for a long time, not easy to deformation or fracture.

Corrosion resistance: can withstand a variety of chemical corrosion, suitable for handling corrosive liquids or gases in the working environment.

Wear resistance: high hardness, with good wear resistance, can be used for a long time without failure.

Strong adsorption force: the groove structure reduces the contact area of the chuck, thereby increasing the adsorption force of unit area and enabling the workpiece to be adsorbed more firmly.

High stability: Due to the characteristics of the material, the chuck has high stability and can work stably for a long time.

High precision: 12 inches diameter, flatness is controlled within 2 μm; If you need more precision, please email us.

Shape control: Adjust the chuck shape according to the wafer shape.

Absorptive responsiveness: Customized design according to specifications.

The ring groove chuck plays a pivotal role in the semiconductor production process by providing a reliable and efficient solution for absorbing, fixing, transferring, and handling silicon wafers, as well as various other workpieces and materials. This versatile tool is specifically designed to meet the stringent demands of semiconductor manufacturing equipment, ensuring precision and stability throughout the production workflow.

One of the key functions of the ring groove chuck is its ability to securely absorb and hold silicon wafers and other delicate materials in place during various stages of the production process. Its high level of grip and stability minimizes the risk of slippage or damage to the wafers, contributing to the overall quality and yield of the semiconductor production.

Furthermore, the ring groove chuck facilitates the transfer of silicon wafers and workpieces between different processing stations, enabling seamless workflow automation and operational efficiency. Its precise positioning and reliable grip ensure smooth and accurate transfer, reducing the likelihood of misalignment or mishandling.

In addition to its primary function of handling silicon wafers, the ring groove chuck is also versatile enough to accommodate a wide range of workpieces and materials, adding flexibility to the semiconductor production process. This adaptability makes it an indispensable tool for various manufacturing applications, contributing to increased productivity and operational agility.

Overall, the ring groove chuck stands as an essential component in semiconductor production equipment, offering unparalleled reliability and performance in the absorption, fixation, transfer, and handling of silicon wafers, workpieces, and materials. Its contribution to the efficiency and precision of semiconductor manufacturing processes is undeniable, making it a cornerstone of modern semiconductor production.