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Production Technology

Strict production process and high precision production & testing equipment to ensure the high quality of products.

ceramic embryo molding

Dry Pressing Process

Dry pressing is one of the most widely used molding process, the main advantages are high molding efficiency, small size deviation of molded products, especially suitable for a variety of small section thickness of ceramic products, such as ceramic valve core, ceramic plate, ceramic ring...etc.

Isostatic Pressing Process And Characteristics

Generally speaking, Isostatic Pressing moulding is Cold Isostatic Pressing(CIP), according the different forming process, and can be divided into two forms: wet bag type and dry bag type. Wet bag isostatic pressing technology is to place granulated ceramic powder or pre-formed billet into a deformable rubber envelope, and then apply uniform pressure in all directions through the liquid. When the pressing process is over, the rubber envelope containing the billet is removed from the container, which is a discontinuous forming method.

Isostatic Pressing Moulding Has The Following Advantages Over Steel Die Pressing Moulding:

1. It can form parts with concave, hollow, slender and other complex shapes.
2. Small friction loss, large molding pressure.
3. The pressure is transferred from all directions, and the compact density is evenly distributed.
4. Low mold cost.



Ceramic Sintering

Ceramic blank is composed of many individual solid particles before sintering, there are a large number of pores in the body, the porosity is generally 35%~60% (that is, the relative density of the blank is 40%~65%), the specific value depends on the characteristics of the powder itself and the molding method and technology used. When the solid blank is heated at high temperature, the particles in the blank transfer, after reaching a certain temperature, the blank shrinks, the grain growth occurs, accompanied by the elimination of pores, and finally the blank becomes a dense polycrystal ceramic material at a temperature below the melting point, this process is called sintering.

The maximum sintering size of alumina ceramics: length 2300* width 800mm, the highest sintering temperature 1700 degrees.
The maximum sintering size of silicon carbide ceramics: length 1300* width 500mm, the highest sintering temperature 2200 degrees.

Internal And External Circular Grinding

Inner and outer circular grinding (also known as center grinding) is used to grind the outer circular surface and shoulder of the workpiece. The workpiece is mounted on the center and is rotated by a device called the center driver. Grinding wheels and workpieces are rotated at different speeds by separate motors. The clamping position of the product can be adjusted at an Angle to produce taper. There are five types of external diameter (OD) grinding, internal diameter (ID) grinding, punch grinding, creep feed grinding and centerless grinding.

Precision control: Inside diameter 10-30mm, roundness can be controlled at 0.002mm, Outer diameter: 10-30mm, roundness can be controlled at 0.0015mm.

External Diameter Grinding

External diameter grinding is grinding on the outer surface of an object between the center and the center. The center is an end cell with a point that allows the object to rotate. When the grinding wheel is in contact with the object, the grinding wheel also rotates in the same direction. This effectively means that when contacted, the two surfaces will move in opposite directions, which makes the operation more stability and less blocking.

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Internal Diameter Grinding

Internal diameter grinding is grinding inside an object. The width of the grinding wheel is always less than the width of the object. The object is held in place by the fixture, which also rotates the object in place. Just like external diameter grinding, the wheel and the object rotate in opposite directions so that the contact direction of the two surfaces where grinding occurs is opposite.

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Flat Grinding

Flat grinding is the most common grinding operation. It is a processing technology that uses a rotating grinding wheel to grind the surface of metal or non-metal materials to remove the oxide layer and impurities on the surface of the workpiece, so as to make its surface more refined. A flat grinder is a machine tool designed to provide accurate grinding surfaces, whether critical size or surface finishment. The specific accuracy of the flat grinder depends on its type and use, the diameter is 300mm of disc, the planimetric accuracy can be reach 0.003mm. The maximum processing size of flat grinding: length 1600* width 800mm.



CNC milling is considered to be one of the most widely used operations in machining. CNC milling is a kind of CNC machine tool with strong processing function, the rapidly developed machining center, flexible machining unit, etc. are produced on the basis of CNC milling machine and CNC boring machine, both are inseparable from the milling method, most industrial milling operations can be completed by 3-axis, 5-axis CNC machine tools. With the advantages of strong adaptability, high processing accuracy, stable processing quality and high production efficiency, this type of path control can process up to 80% of mechanical parts. CNC has a maximum machining size: length 1300* width 800mm.

Semiconductor Component Cleaning Process

All factory products are inspected by precision testing instruments to ensure that the quality of factory products is zero defects.

Reliable precision cleaning and surface treatment technology is an indispensable support for semiconductor, flat panel display, precision optics fields. Cleaning process refers to the process of removing surface impurities through chemical treatment, gas and physical methods. In the semiconductor manufacturing process, impurities such as particles, metals, organic matter, natural oxide layer on the wafer surface may affect the performance, reliability and even yield of semiconductor devices. The cleaning process can be said to be the bridge between the front and back of each wafer manufacturing process. For example, the cleaning process is used before the coating process, before the lithography process, after the etching process, after the mechanical grinding process and even after the ion implantation process. The cleaning process can be roughly divided into two types, namely wet cleaning and dry cleaning.

Wet Cleaning

Wet cleaning is the use of chemical solvents or deionized water to clean the wafer. Wet cleaning can be divided into soaking method and spraying method according to the process method, soaking method is to immerse the wafer into a container tank containing chemical solvent or deionized water. Soaking method is a widely used method, especially for some mature nodes. Spraying, on the other hand, involves spraying a chemical solvent or deionized water onto a rotating wafer to remove impurities. The soaking method can process multiple wafers at the same time, and the spraying method can only process one wafer in one working chamber at the same time. With the development of the process, the requirements of the cleaning process are becoming higher and higher, and the use of spraying method is becoming more and more extensive.

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Dry Cleaning

As the name suggests, dry cleaning is not the use of chemical solvents or deionized water, but the use of gas or plasma to clean. With the continuous advancement of technical nodes, the requirements of the cleaning process are becoming higher and higher, the proportion of use is also increasing, and the waste liquid generated by wet cleaning is also a large increase. Compared with wet cleaning, dry cleaning has high investment cost, complex equipment operation and harsher cleaning conditions. However, for the removal of some organic compounds and nitrides, oxides, dry cleaning accuracy is higher, the effect is excellent.

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Precision Measurement

We have talents in material research, product development, design, manufacturing and quality management, and have a full set of precision machining and testing equipment: three coordinates, roughness meter, concentricity meter, outer diameter measuring instrument, cylindricity meter of precision testing instruments. Strict production process and high precision production & testing equipment to ensure the high quality of products.

DLC Coating

DLC coating, also known as diamond-like coating, with high hardness (>HV1500) and low dry friction coefficient (0.05-0.1). It is an oil-free self-lubricating coating. DLC coating material characteristics can dissipate static electricity, black does not reflect light, the thickness can reach 0.55um, so there is no need to worry about the size of the trouble. And with the latest technology to make the product has good lubrication, heat dissipation (dry). The life of the workpiece can be increased by 10-50 times, and the working efficiency can be increased by 600%, in order to reduce the production cost. Fountyl has recently introduced DLC coatings on our alumina, silicon carbide ceramic wafer carriers, vacuum chucks and especially silicon carbide pin chucks products.

Wafer carrier/gripper tables are used to contain Si, SiC, GaAs, Gan, and other semiconductor wafers in a variety of semiconductor processes, from detection to lithography, and other high-precision demanding applications, including housing large, thin flexible flat panel displays, MEMS, and biological cells. DLC coatings have many desirable properties, such as durable resistance and high thermal conductivity, to maximize product life, maintain the accuracy, and reduce friction and contamination. The vacuum gripper consists of a rigid body with multiple gripper on the surface of the wafer or panel, and the deviation of the overall and local flatness is measured in nanometers, in this case, the problem with applying a DLC coating on the entire surface of the gripper is that the thermal expansion mismatch can lead to a loss of flatness.


Teflon™ fluoropolymer for semiconductor manufacturing

Chemically inert Teflon™ fluoropolymers enable the equipment and systems needed to deliver high-performance, non-polluting gases and chemicals in the chip manufacturing process. We can make Teflon coatings on ceramic products, these reliable high quality fluoropolymers can achieve:

1. Fluoropolymer shows outstanding chemical resistance, which can ensure that highly corrosive chemicals in the chip manufacturing process will not pollute the ultra-clean environment.

2. Superior electronic properties (such as low dielectric constant and low loss factor) as well as excellent UV protection and moisture resistance are essential for advanced wafer-level packaging.


3. Fluoropolymer resin has made significant progress in bending life, chemical stress cracking resistance and weldability, suitable for parts dealing with high purity fluids.

4. Components and tools manufactured with Teflon™ products perform well even after prolonged exposure to highly active chemicals. In integrated circuit manufacturing, components manufactured with Teflon™ products prevent fluid contamination after use, maintaining high yield of the process and performance stability.

5. Semiconductor manufacturing involves many complex processes. Each Teflon™ fluoropolymer product is designed to meet the highest standards of purity, reliability and durability.