Precision analysis of high performance semiconductor equipment
Generation of platform-based positioning accuracy: Position accuracy is affected by the spatial position relative to the user's payload or the platform on which the sensor is located
The coupling technology analysis of dual drive motion platform and the research technology summary of motion control
Direct-drive motion platforms are an indispensable component in precision motion control applications, such as semiconductor devices, lithography machines and precision machining industries.
Ceramic molding: high pressure grouting molding
High pressure grouting molding ceramics is an important ceramic manufacturing process, which is characterized by the use of high pressure grouting technology to mix ceramic powder and liquid additives into the mold, and then molding through high pressure environment.
Semiconductor technology -XY2Z wafer inspection platform structure design explanation
In semiconductor detection technology, the detection platform is often the core of the machine movement, the platform needs to withstand high-speed and high-frequency movement, and the accuracy needs to be nano-level, for seismic and stability has extremely high requirements, with high positioning accuracy and stability! And can be applied to a variety of non-contact and contact inspection. Wafer inspection platforms generally require multi-degree of freedom movement, and need to provide X, Y, Z and Theta axis movement to support various specifications of wafers.
Black alumina ceramics
"Black" is not usually a beautiful color, black alumina ceramics in recent years more and more attention, not because of its "appearance level", or because of its special practicability - can block light, black can absorb all wavelengths of visible light, do not let the light through.
Electrostatic chuck
Electrostatic chuck is a kind of ultra-clean wafer carrier suitable for vacuum environment or plasma environment. It uses the principle of electrostatic adsorption to carry out flat and uniform clamping of ultra-thin wafer, and is widely used in PVD, PECVD, ETCH, EUVL, ion implantation and other semiconductor manufacturing equipment.
Semiconductor parts market size
Semiconductor components first fall into two broad categories
Research on vacuum semiconductor equipment parts industry
At present, domestic vacuum semiconductor parts are equivalent to the development stage of domestic semiconductor equipment about 3 to 5 years ago, and several domestic suppliers of various parts and components continue to research and development, but are limited by the technology gap has not fully met the needs of downstream semiconductor equipment manufacturers
【 Micro and Nano processing 】 The key role of vacuum chuck in wafer fixation
As the basic carrier of semiconductor chip, the stability of wafer in semiconductor processing is particularly important. In this field, vacuum chuck stand out with their unique advantages and become an indispensable part of the semiconductor manufacturing line.
Advanced Packaging: The "battle for turnaround" of packaging
Packaging refers to the packaging of integrated circuit chips or other semiconductor devices in a protective housing, such housing can achieve mechanical support, electrical connection and environmental protection.