What is the use of silicon oxide (SiO2) film?

The entire semiconductor manufacturing process is very common and indispensable, what is it used for?

Physical and chemical properties of silicon oxide?

Silicon oxide (SiO2) usually exists in nature in the form of quartz crystals, and in the semiconductor manufacturing process CVD or PVD in the form of amorphous. High hardness, high melting point, excellent chemical stability, almost no reaction with other chemicals, good insulation performance, low coefficient of thermal expansion.

The application of silicon oxide film in semiconductor manufacturing?

1. Used as a mask layer for etching, diffusion and ion implantation; As an etching mask, silicon oxide has high selectivity and does not react with chemicals and gases. As a diffusion and ion implantation mask, it prevents the diffusion of doped substances such as boron and phosphorus to other regions of the silicon wafer, so that the boundary of the doping region can be precisely controlled;

2, used as insulation media (isolation, insulation grid, multi-layer wiring insulation, capacitive media, etc.); As an isolation layer, it helps to reduce the crosstalk between various parts; As a gate oxide layer, it can effectively control the gate voltage to regulate the carrier of the channel, so as to control the current flowing through the transistor. As a dielectric layer, it is used to isolate the metal layers between different layers, which can prevent current leakage and short circuit.

3, used for surface protection and passivation. Silicon oxide films can be used as a protective layer, covering the surface of sensitive materials to protect them from external moisture, pollutants and chemical corrosion. As a passivation layer to improve the chemical and electrical properties of semiconductor surfaces. It can effectively prevent the activity of surface atoms, reduce surface defects, and improve the electrical performance of the device.

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