Silicon Carbide
Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
Silicon carbide ceramics have excellent mechanical properties at normal temperature, such as high strength, high hardness, high elastic modulus, excellent high temperature stability, such as high thermal conductivity, low thermal expansion coefficient, and good specific stiffness and optical processing properties, especially suitable for the preparation of photolithography machine and other integrated circuit equipment for precision ceramic structural parts. Such as used in the photolithography machine precision moving workpiece table, skeleton, suction cup, water-cooled plate and precision measurement mirror, grating and other ceramic structural parts, Fountyl new material after years of technical research, solve the large size, thin wall, hollow and other complex structure of silicon carbide structural parts precision processing and preparation problems, breaking through the technical bottleneck of this kind of precision silicon carbide structural parts preparation technology. It has greatly promoted the localization of key structural parts used in integrated circuit manufacturing equipment.
● Silicon carbide ceramics mainly include pressureless sintering silicon carbide (SSiC), reaction-sintered
silicon carbide (RBSC), chemical vapor deposition silicon carbide (CVD-SiC).
● Silicon carbide has a variety of excellent properties: super hard, wear resistance, high thermal conductivity
and mechanical strength, low thermal expansion coefficient, excellent thermal stability, low density, high
specific stiffness, non-magnetic.
● At present, silicon carbide ceramics are applied in various industries such as aviation, aerospace and
nuclear industry, such as ceramic parts of high-end equipment for silicon carbide ceramic reflector and IC
integrated circuit manufacturing, heat exchangers and bulletproof materials under extreme conditions.
Features of precision ceramic structural parts for integrated circuit manufacturing equipment:
① Highly lightweight: In order to reduce the motion inertia, reduce the motor load, improve the motion efficiency, positioning accuracy and stability, the structural parts generally use lightweight structure design, the lightweight rate is 60-80%, up to 90%;
② High form-position accuracy: In order to achieve high-precision movement and positioning, the structural parts are required to have extremely high form and position accuracy, the flatness, parallelism and perpendicularity are required to be less than 1μm, and the form and position accuracy is required to be less than 5μm.
③ High dimensional stability: In order to achieve high-precision movement and positioning, the structural parts are required to have extremely high dimensional stability, not to produce strain, and high thermal conductivity, low thermal expansion coefficient, not easy to produce large dimensional deformation;
④ Clean and pollution-free. The structural parts are required to have extremely low friction coefficient, small kinetic energy loss during movement, and no grinding particle pollution. Silicon carbide material has a very high elastic modulus, thermal conductivity and low thermal expansion coefficient, is not easy to produce bending stress deformation and thermal strain, and has excellent polishability, can be machined to excellent mirror; Therefore, It has great advantages to use silicon carbide as the precision structural material for the key equipment of integrated circuits such as photolithography machine, Silicon carbide has the advantages of good chemical stability, high mechanical strength, high thermal conductivity and low thermal expansion coefficient, and can be applied in high temperature, high pressure, corrosion and radiation of extreme environments.
Silicon carbide has the advantages of good chemical stability, high mechanical strength, high thermal conductivity and low thermal expansion coefficient, and can be applied in high temperature, high pressure, corrosion and radiation of extreme environments.
The key equipment of integrated circuit requires that the component materials have the characteristics of light weight, high strength, high thermal conductivity and low thermal expansion coefficient, and are dense and uniform without defects. Components are required to have extremely high dimensional accuracy and dimensional stability to ensure ultra-precision movement and control of the equipment. Silicon carbide ceramics have a high elastic modulus and specific stiffness, not easy to deform, and has a high thermal conductivity and low thermal expansion coefficient, high thermal stability, so silicon carbide ceramics is an excellent structural material, currently in the integrated circuit manufacturing of key equipment to obtain a wide range of applications, such as lithography machine with silicon carbide working table, guide rail, reflector, ceramic chuck, and ceramic end effector.
Fountyl can meet the photolithography machine as the representative of the integrated circuit manufacturing key equipment with large size, hollow thin wall, complex structure, precision silicon carbide structural parts preparation technology, such as: silicon carbide vacuum chuck, guide rail, reflector, working table and a series of precision silicon carbide structural parts for photolithography machine.
| Properties | Fountyl | ||
| Density（g/cm3) | 2.98-3.02 | ||
| Young’s Modulus（GPa） | 368 | ||
| Flexural strength（MPa） | 334 | ||
| Weibull | 8.35 | ||
| CTE（×10-6/℃） | 100℃ | 2.8×10-6 | |
| 400℃ | 3.6×10-6 | ||
| 800℃ | 4.2×10-6 | ||
| 1000℃ | 4.6×10-6 | ||
| Thermal Conductivity(W/m·k) (20 ºC) | 160－180 | ||
| Poisson’s ratio | 0.187 | ||
| Shear modulus（GPa） | 155 | ||