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Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
Zirconia used for wear resistant parts, heat resistant parts

Zirconia used for wear resistant parts, heat resistant parts
Quartz glass melted with various kinds of pure natural quartz

Quartz glass melted with various kinds of pure natural quartz
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
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Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry
Porous ceramic with high temperature resistance, high strength, good chemical stability

Porous ceramic with high temperature resistance, high strength, good chemical stability
Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

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Microporous Ceramic Vacuum Chuck

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Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

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Ball milling is a grinding method, mainly through the ball as a medium, the use of impact, extrusion and friction to achieve the crushing of materials.

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According to DigiTimes, TSMC's 2nm chip research and development work has made significant progress. This important node marks TSMC's next big step in chip manufacturing technology and will lay a ...

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