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High Warp Wafer Chuck Exporter - Top Supplier of High-Quality Chuck Systems

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Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

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PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability
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Zirconia used for wear resistant parts, heat resistant parts
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Square beam & guide rail for ultra-precision motion platform and detection equipment

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Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
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Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

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High precision ceramic piston for new energy and medical fields

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Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").

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Epitaxy refers to a crystal growth or material deposition technology that occupies an extremely important position in microelectronics and optoelectronics manufacturing processes

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