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Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
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Wafer pin chuck used for semiconductor exposure device and wafer inspection device
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Zirconia used for wear resistant parts, heat resistant parts

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Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
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Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
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Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry
Square beam & guide rail for ultra-precision motion platform and detection equipment

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