Products
Electrostatic chuck with compatibility, high-density, hight structural strength with customized
Features
Compatibility | Customization | High-Density | High Structural Strength | Fast Delivery Time | Cost-effective
Applications
Lon-implantation | Thin Film | Etch | Process Development | Equipment Design
Design and Manufacture
12 inch Fab delivered to verify the actual performance, provide regeneration and repair, and verify the development and design.
With the process equipment and process technology development of semiconductor and integrated circuit, the traditional electrostatic chucks using organic polymer materials, metal oxides and ceramic materials as dielectrics are not fully compatible with such materials as silicon wafers, sapphire and silicon carbide. Therefore, electrostatic chucks compatible with the first, second and third generation semiconductor wafer grippers will gradually develop.
Polymer Electrostatic Chuck / Heater
Polymer dielectric material (Polymer) is currently the most widely used electrostatic chuck material, its preparation process is also the most mature, polymer dielectric material after polymer modification treatment, electrical, mechanical, temperature resistance, halogen resistance properties will be greatly improved. The dielectric material is patterned by other integrated operations, and then layered by multistage vacuum heavy load, and a dense dielectric insulation layer is formed between the internal electrodes.
Polymer Electrostatic Chuck
The polymer modification technology is used to achieve higher bulk resistivity and relative dielectric constant, and obtain more stable clamping force.
High density dielectric materials can reduce the risk of particulate matter and reduce ion mobility.
The diversity of clamping objects can be compatible with the clamping of wafers of different materials.
Excellent corrosion resistance in halogen and plasma atmospheres.
High cost performance, short acceptance period, suitable for product process development and new equipment development verification.
Polymer Electrostatic Chuck With Heater
It can realize the layout of multiple heating temperature zones (up to 20 temperature zones), and has good heating temperature uniformity (±5%℃@150℃).
Vacuum laminating technology is used to achieve extremely high density and heating temperatures up to 200 ° C.
Uniform heating curve, with a wider range of temperature curve Settings.
High cost performance, short acceptance period, suitable for product process development and new equipment development verification.
Ceramics Electrostatic Chuck / Heater
Ceramic coagulation technology is an improved sintering process in the development of alumina/aluminum nitride ceramic electrostatic chucks and heaters. Its core is to use a variety of nanometer diameter ceramic powders, which are mixed in a certain proportion through a unique mixing equipment and mixing process. Ceramic electrostatic chucks with high density, stable crystal structure and uniform resistivity distribution were sintered with a certain sintering temperature curve in sintering equipment. The static chuck manufactured by ceramic coagulation technology has high density, stable crystal structure and uniform volume resistivity distribution, and can realize the normal clamping function of the chip in the harsh environment under high vacuum, plasma and halogen.
Al₂O₃ Electrostatic Chuck
The volume resistivity is controlled by coagulation ceramic technology and co-firing process to obtain a longer holding force.
The internal structure of high temperature sintering is dense and the crystal structure is stable, and the holding capacity of a larger temperature interval can be obtained.
Integrated co-firing molding reduces ion migration.
Lasting operation in plasma halogen vacuum atmosphere.
AlN Electrostatic Chuck
By controlling the composition and proportion of the concrete material, the volume resistivity can be controlled and the holding capacity in a larger temperature interval can be obtained.
The uniform temperature zone distribution is ensured by the sintering technology and co-firing process of concrete ceramics.
Integrated co-firing molding to maximize product quality.
Lasting operation in plasma halogen vacuum atmosphere.
Ceramics Electrostatic Chuck With Heater
It can realize the layout of multiple heating temperature zones, and has good heating temperature uniformity (±7.5%℃@350℃).
Vacuum laminating sintering technology is used to achieve extremely high densification and heating temperatures up to 550℃.
Integrated co-firing molding to maximize product quality.
Lasting operation in plasma halogen vacuum atmosphere.
Complex Type Electrostatic Chuck / Heater
Can be compatible with silicon, gallium arsenide, silicon carbide, sapphire of wafer clamping, can reduce the wire change costs of equipment manufacturers and end users. Based on concrete ceramic technology and polymer modification technology, the use of integrated vacuum lamination and hot bonding technology can reduce the internal thermal resistance of electrostatic sucker, achieve internal temperature uniformity, form a dense dielectric insulation layer to improve the ion migration resistance performance.
Complex Type Electrostatic Chuck
The use of concrete ceramic and polymer modification technology, has a higher dense structure and lower gas release.
Tighter control of dielectric layer and electrode bank thickness.
The diversity of clamping objects can be compatible with the clamping of different wafers.
The resistivity of the body can be accurately controlled to obtain a stronger electrostatic holding capacity.
High cost performance, short acceptance period, suitable for product process development and new equipment development verification.
Complex Type Electrostatic Chuck With Heater
It can realize the layout of multiple heating temperature zones, and has good heating temperature uniformity (±3.5%℃@150℃).
Vacuum laminating technology is used to achieve extremely high density and heating temperatures up to 200 ° C.
Uniform heating curve, with a wider range of temperature curve Settings.
High cost performance, short acceptance period, suitable for product process development and new equipment development verification.