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Explore Our Custom Silicon Manufacturing Process for High-Quality Semiconductor Devices

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Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

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PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability
Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
Porous ceramic with high temperature resistance, high strength, good chemical stability

Porous ceramic with high temperature resistance, high strength, good chemical stability
Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

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Wafer pin chuck used for semiconductor exposure device and wafer inspection device

Wafer pin chuck used for semiconductor exposure device and wafer inspection device
Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams

Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
High precision ceramic piston for new energy and medical fields

High precision ceramic piston for new energy and medical fields
Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
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CMP chemical mechanical polishing equipment principle and the introduction of domestic and foreign equipment manufacturers

Chemical mechanical polishing (CMP) is a technique used in the fabrication of integrated circuit chips to achieve wafer surface flatness

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