Understanding Electrostatic Dissipation: Prevention and Solutions

Top Selling Products

Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

Ceramic structural parts (ceramic parts)

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

High precision ceramic piston for new energy and medical fields

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Related Blog

How are wafers stored and shipped?

What are the special requirements for the storage and transportation of wafers after they have completed all the processes in the fab? Do special environmental packaging be required?

What are the methods of wafer scribing?

Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").

Related Search

Leave Your Message

Understanding Electrostatic Dissipation: Prevention and Solutions

Related products

Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Microporous Ceramic Vacuum Chuck

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

Zirconia used for wear resistant parts, heat resistant parts

Quartz glass melted with various kinds of pure natural quartz

Porous ceramic with high temperature resistance, high strength, good chemical stability