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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Ceramic end effector(ceramic finger, ceramic robot arm)

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

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A mature SPI equipment, 3D solder paste detection machine introduction

After many years of market application, this SPI detection equipment has been quite mature and efficient

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