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Upgrade Your System with Ceramic Chucks End Effectors | Best Quality Available

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

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Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields

Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields
Microporous Ceramic Vacuum Chuck

Microporous Ceramic Vacuum Chuck
Ceramic end effector(ceramic finger, ceramic robot arm)

Ceramic end effector(ceramic finger, ceramic robot arm)
Square beam & guide rail for ultra-precision motion platform and detection equipment

Square beam & guide rail for ultra-precision motion platform and detection equipment
Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

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High precision ceramic piston for new energy and medical fields

High precision ceramic piston for new energy and medical fields
Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry
Porous ceramic with high temperature resistance, high strength, good chemical stability

Porous ceramic with high temperature resistance, high strength, good chemical stability
Zirconia used for wear resistant parts, heat resistant parts

Zirconia used for wear resistant parts, heat resistant parts
Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
Wafer pin chuck used for semiconductor exposure device and wafer inspection device

Wafer pin chuck used for semiconductor exposure device and wafer inspection device
Related Blog

What are the methods of wafer scribing?

Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").

Semiconductor technology and equipment: chip testing and equipment

Testing is an important means to ensure function and yield. Chip testing can be divided into two main parts. CP(chip probering) and FT(final test). Some chips also perform SLT (system leve test). ...

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