Application and characteristics of porous chuck table

Porous ceramics are ceramics with many holes in the material itself through ceramic sintering technology, and are used in vacuum suckers. Recently, it has been widely used as a base material for various industrial products, such as filters, refractories, kiln wares, absorbers, sound absorbers, lightweight structural materials, insulation materials, etc. In particular, it is used in vacuum absorption technology with high precision and high vacuum. It has the ability to absorb ultra-thin objects, which is recently required for the production of semiconductors, LED and displays. It is very important that porous ceramics have high porosity and maintain high strength. Especially in the semiconductor and display screen industry, porous ceramics should have uniform porosity and good surface roughness so as not to damage the absorbing object. porous ceramic vacuum sucker have the following different names:

1、 Ceramic vacuum sucker

2、 Air floating table

3、 Porous ceramic vacuum sucker

4、 Precision porous ceramic local adsorption vacumm sucker

5、 Breathable ceramic vacuum sucker

6、 Porous ceramic chuck table

7、 Precision porous ceramic local vacuum sucker

8、 Porous air floating table

9、 Porous ceramic chuck table

Working principle of porous ceramic vacuum sucker:

Because the pores of porous ceramics are very minuteness, when the workpiece surface is fitted to the vacuum sucker, it will not cause surface scratches, dents and other bad phenomenon because of negative pressure. Through the combination of metal (or ceramic) base and special porous ceramics, the internal precision air conduction design allows the workpiece to be smoothly and firmly adsorbed on the vacuum sucker when negative pressure is applied.

Application

1. Special ceramic vacuum sucker module for absorbing planar workpiece

2, Adsorption up to half the area will not break the vacuum

3, Suitable in the clean environment for machine manufacturing or factory production, assembly or automation industry

4, Semiconductor wafer sucker, micro chip equipment industry, cutting, grinding, cleaning, etc.

5, TFT-LCD, LED equipment industry.

6, Exposure machine, glass cutting machine, glass substrate air floating transport.

7, Printed circuit board equipment industry.

8, Mechanical arm handling equipment industry.

9, Ceramic vacuum grasping module, dedicated to grasping plane workpiece.

10, If you can keep to grab a half of the area, then the ceramic holder will not lose the workpiece. multiple workpieces can use the same ceramic chuck.

Features

1, Good wear resistance: hard characteristics, wear resistance, not easy to scratch and damage.

2, Not easy to decompose and dust: ceramics are completely sintered, solid and stable structure, no dust.

3, Lightweight: light material and internal structure is uniform porosity, extremely light weight.

4, Regional adsorption: can absorb different sizes of the workpiece on the same ceramic working surface.

5, High temperature resistance, chemical resistance: ceramics is high temperature sintering products, good heat resistance and acid & alkali resistance, a wide range of applications

6, High electrical performance: with insulation, dissipating electrostatic characteristics (depending on the material).

7, Various sizes: any shape and size are ok.

Porous ceramics with high porosity are good, but the higher the porosity, the lower the strength of the material. In addition, when the pore density is low, the porosity becomes low or the pore size becomes larger at the same porosity. Therefore, materials with low pore density also have lower strength. Porous ceramics are ceramics with many pores in the material, which are used for vacuum suckers through ceramic sintering technology.

Porous ceramic chuck is also one of the main products of Singapore Fountyl Technologies PTE Ltd., R&D and production for such kind of product for more than 10 years, the main material is porous ceramics, the main components of material is alumina and silicon carbide, used in silicon wafers, semiconductor compound wafers, glass, piezoelectric ceramics, LED, semiconductor packaging component substrate, optical component thinning, cutting fields.