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Top Vacuum Ceramic End Effector Manufacturers for Precision Handling

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Ceramic end effector(ceramic finger, ceramic robot arm)

Ceramic end effector(ceramic finger, ceramic robot arm)

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Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts
Quartz glass melted with various kinds of pure natural quartz

Quartz glass melted with various kinds of pure natural quartz
Microporous Ceramic Vacuum Chuck

Microporous Ceramic Vacuum Chuck
Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability
Wafer pin chuck used for semiconductor exposure device and wafer inspection device

Wafer pin chuck used for semiconductor exposure device and wafer inspection device

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Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
High precision ceramic piston for new energy and medical fields

High precision ceramic piston for new energy and medical fields
Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance
Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
Square beam & guide rail for ultra-precision motion platform and detection equipment

Square beam & guide rail for ultra-precision motion platform and detection equipment
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Ball milling is a grinding method, mainly through the ball as a medium, the use of impact, extrusion and friction to achieve the crushing of materials.

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Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").

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