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OEM Pressing Method in Ceramics: Techniques and Applications

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High precision ceramic piston for new energy and medical fields

High precision ceramic piston for new energy and medical fields

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Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
Wafer pin chuck used for semiconductor exposure device and wafer inspection device

Wafer pin chuck used for semiconductor exposure device and wafer inspection device
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
Ceramic structural parts (ceramic parts)

Ceramic structural parts (ceramic parts)
Quartz glass melted with various kinds of pure natural quartz

Quartz glass melted with various kinds of pure natural quartz

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Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams

Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
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Ceramic end effector(ceramic finger, ceramic robot arm)
Microporous Ceramic Vacuum Chuck

Microporous Ceramic Vacuum Chuck
Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance
Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
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What are the methods of wafer scribing?

Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").

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