Iteknoloji yeMveliso

Inkqubo yokuvelisa engqongqo kunye nemveliso echanekileyo ephezulu kunye nezixhobo zokuvavanya ukuqinisekisa umgangatho ophezulu weemveliso.

UKUBUMBA KWEEMBRYO YECERAMIC

UKUSEKA KWECERAMIC

UkuSila Ngaphakathi Nangaphandle kweSetyhula

UkuSila ngeFlethi

CNC

Ukucoca ngoKuchaneka kwezinto

Umlinganiselo ochanekileyo

DLC ukutyabeka

I-Teflon UKUBEKA

Inkqubo yokuCofa okomileyo

Ukucinezela okomileyo yenye yezona nkqubo zisetyenziswa kakhulu ekubumbeni, iingenelo eziphambili kubuchule obuphezulu bokubumba, ukutenxa ubungakanani obuncinci beemveliso ezibunjiweyo, zilungele ngakumbi ubungakanani becandelo elincinci lemveliso ye-ceramic, njengesiseko sevalve ye-ceramic, ipleyiti ye-ceramic, i-ceramic plate. ring...njl.

Inkqubo ye-Isostatic Pressing kunye neempawu

Ngokuqhelekileyo, ukubunjwa kwe-Isostatic Pressing yi-Cold Isostatic Pressing (CIP), ngokwenkqubo eyahlukileyo yokubumba, kwaye inokwahlulwa ibe ziifom ezimbini: uhlobo lwengxowa emanzi kunye nohlobo lwebhegi eyomileyo. Ibhegi emanzi ye-isostatic yokucinezela itekhnoloji kukubeka umgubo weceramic egranulated okanye i-billet eyenziwe ngaphambili kwimvulophu yerabha enokukhubazeka, kwaye emva koko ufake uxinzelelo olufanayo kuwo onke amacala ngolwelo. Xa inkqubo yokucinezela iphelile, imvulophu yerabha equkethe i-billet iyasuswa kwi-container, eyona ndlela yokuyeka ukuyeka.

I-Isostatic Pressing Molding inezi zinto ziluncedo zilandelayo ngaphaya kokuBunjwa kwentsimbi yokufa:

1. Inokwenza iinxalenye ezine-concave, i-hollow, i-slender kunye nezinye iimilo ezinzima.

2. Ilahleko encinci ye-friction, uxinzelelo olukhulu lokubumba.

3. Uxinzelelo ludluliselwa kuzo zonke iindlela, kwaye ukuxinana kwe-compact kuhanjiswe ngokulinganayo.

4. Ixabiso eliphantsi lokungunda.

I-Ceramic Sintering

I-Ceramic blank iqulunqwe ngamasuntswana amaninzi aqinileyo phambi kokuba i-sintering, kukho inani elikhulu leepores emzimbeni, i-porosity ngokubanzi yi-35% ~ 60% (oko kukuthi, ukuxinana okungenanto yi-40% ~ 65%), ixabiso elithile lixhomekeke kwiimpawu zomgubo ngokwawo kunye nendlela yokubumba kunye nobuchwepheshe obusetyenzisiweyo. Xa indawo engenanto eqinileyo ifudunyezwa kubushushu obuphezulu, amasuntswana ekudluliselweni okungenanto, emva kokufikelela kwiqondo lobushushu elithile, into engenanto iyancipha, ukukhula okuziinkozo kwenzeka, kukhatshwa kukupheliswa kweepores, kwaye ekugqibeleni into engenanto iba yinto eshinyeneyo ye-polycrystal ceramic. iqondo lobushushu elingaphantsi kwendawo yokunyibilika, le nkqubo ibizwa ngokuba sintering.

Ubukhulu be-sintering ye-alumina ceramics: ubude be-2300 * ububanzi be-800mm, ubushushu obuphezulu be-sintering yi-1700 degrees.

Obona bukhulu sintering ubukhulu besilicon carbide ceramics: ubude 1300* ububanzi 500mm, iqondo eliphezulu sintering 2200 degrees.

UkuSila Ngaphakathi Nangaphandle kweSetyhula

Ukusila ngaphakathi nangaphandle kwisetyhula (ekwabizwa ngokuba kukusila okuphakathi) kusetyenziselwa ukugaya umphezulu wesetyhula wangaphandle kunye negxalaba lomsebenzi. I-workpiece ifakwe embindini kwaye ijikeleziswa sisixhobo esibizwa ngokuba ngumqhubi weziko. Amavili okugaya kunye nezixhobo zokusebenza zijikelezwa ngesantya esahlukileyo ngeenjini ezahlukeneyo. Isikhundla sokubambelela kwimveliso sinokuhlengahlengiswa kwi-Angle ukuvelisa i-taper. Zintlanu iintlobo zokugaya ngaphandle kwedayimitha yangaphandle (OD), idiameter yangaphakathi (ID) yokugaya, i-punch grinding, i-creep feed grinding kunye nokusila okungenaziko.

Ulawulo oluchanekileyo: Ngaphakathi ubukhulu be-10-30mm, ukujikeleza kunokulawulwa kwi-0.002mm,Ububanzi bangaphandle: 10-30mm, ukujikeleza kungalawulwa kwi-0.0015mm.

UkuSila kweDiameter yangaphandle

Ukusila kwedayamitha yangaphandle kukusila kumphezulu ongaphandle wento phakathi kweziko kunye neziko. Umbindi yiseli yesiphelo enenqaku elivumela into ukuba ijikeleze. Xa ivili lokugaya lidibana nento, ivili lokugaya libuye lijikeleze kwicala elifanayo. Oku kuthetha ngokufanelekileyo ukuba xa uqhagamshelwe, iindawo ezimbini ziya kuhamba ngendlela echaseneyo, eyenza umsebenzi uzinzile kwaye uthintele ngaphantsi.

UkuSila kweDiameter yangaphakathi

Ukusila kwidayamitha yangaphakathi kukusila ngaphakathi kwento. Ububanzi bevili lokugaya buhlala bungaphantsi kobubanzi bento. Into ibanjwe yi-fixture, ephinda ijikeleze into kwindawo. Kanye njengokusila kwedayamitha yangaphandle, ivili kunye nento zijikeleza kumacala achaseneyo ukuze icala loqhagamshelwano lemiphezulu emibini apho kusila lichasane.

UkuSila ngeFlethi

Ukusila okucaba ngowona msebenzi uqhelekileyo wokusila. Itheknoloji yokucubungula esebenzisa ivili elijikelezayo lokugaya ukugaya ubuso besinyithi okanye izinto ezingezizo zetsimbi ukususa i-oxide layer kunye nokungcola phezu kwendawo yokusebenza, ukwenzela ukuba ubuso bayo buhlanjululwe ngakumbi. I-grinder flat sisixhobo somatshini esenzelwe ukubonelela ngeendawo ezichanekileyo zokusila, nokuba ubungakanani obubalulekileyo okanye ukugqitywa kwendawo. Ukuchaneka okuthe ngqo kwe-grinder flat kuxhomekeke kuhlobo lwayo kunye nokusetyenziswa, ububanzi buyi-300mm yediski, ukuchaneka kweplanimetric kunokufikelela kwi-0.003mm. Ubungakanani obuphezulu bokucutshungulwa kokugaya okusicaba: ubude be-1600 * ububanzi be-800mm.

CNC

Ukugaya i-CNC ithathwa njengenye yezona zinto zisetyenziswa kakhulu kumatshini. Ukugaya i-CNC luhlobo lwesixhobo somatshini we-CNC kunye nomsebenzi oqinileyo wokucutshungulwa, iziko lomatshini eliphuhliswa ngokukhawuleza, iyunithi yomatshini oguquguqukayo, njl. njl. ziveliswa ngesiseko somatshini wokugaya we-CNC kunye nomatshini wokudinwa we-CNC, zombini azinakwahlulwa kwindlela yokugaya, uninzi lwamashishini. imisebenzi yokugaya ingagqitywa nge-3-axis, i-5-axis CNC izixhobo zomatshini. Ngeengenelo zokuguquguquka okuqinileyo, ukuchaneka okuphezulu kokusebenza, umgangatho wokucwangcisa uzinzile kunye nokusebenza kakuhle kwemveliso, olu hlobo lolawulo lwendlela lunokuqhuba ukuya kuthi ga kwi-80% yamacandelo omatshini. I-CNC inobungakanani obukhulu bokusebenza: ubude be-1300 * ububanzi 800mm.

Inkqubo yokucoca iSemiconductor Component

Zonke iimveliso zefektri zihlolwa ngezixhobo zokuvavanya ngokuchanekileyo ukuqinisekisa ukuba umgangatho weemveliso zefektri awunaziphene.

Ukucocwa okuthembekileyo okuchanekileyo kunye netekhnoloji yonyango lomphezulu yinkxaso eyimfuneko kwi-semiconductor, umboniso wephaneli ecaba, iindawo ezichanekileyo ze-optics. Inkqubo yokucoca ibhekisela kwinkqubo yokususa ukungcola komhlaba ngokusebenzisa unyango lwekhemikhali, igesi kunye neendlela zomzimba. Kwinkqubo yokuvelisa i-semiconductor, ukungcola okunje ngamasuntswana, isinyithi, i-organic matter, i-natural oxide layer kwi-wafer surface inokuchaphazela ukusebenza, ukuthembeka kunye nesivuno sezixhobo ze-semiconductor. Inkqubo yokucoca inokuthiwa yibhulorho phakathi komphambili nasemva kwenkqubo yokwenziwa kwe-wafer nganye. Ngokomzekelo, inkqubo yokucoca isetyenziswe ngaphambi kwenkqubo yokugubungela, ngaphambi kwenkqubo ye-lithography, emva kwenkqubo yokuqhawula, emva kwenkqubo yokugaya i-mechanical and even after the ion implantation process. Inkqubo yokucoca inokwahlulwa ngokufanelekileyo ibe ziindidi ezimbini, ezizezi, ukucoca okumanzi kunye nokucoca okomileyo.

Ukucoca okumanzi

Ukucoca okumanzi kukusetyenziswa kweekhemikhali zokunyibilikisa okanye amanzi adibeneyo ukucoca i-wafer. Ukucoca okumanzi kunokohlulwa ngendlela yokufunxa kunye nendlela yokutshiza ngokwendlela yenkqubo, indlela yokuntywila kukuntywilisela i-wafer kwitanki yesikhongozeli equlethe isinyibilikisi sekhemikhali okanye amanzi adityanisiweyo. Indlela yokufunxa yindlela esetyenziswa ngokubanzi, ngakumbi kwiindawo ezithile ezisele zikhulile. Ukutshiza, kwelinye icala, kubandakanya ukutshiza isinyibilikisi sekhemikhali okanye amanzi adiyiniweyo kwiwafa ejikelezayo ukususa ukungcola. Indlela yokuntywila inokuqhuba iiwafa ezininzi ngaxeshanye, kwaye indlela yokutshiza inokuqhuba kuphela iwafa enye kwigumbi lokusebenza elinye ngexesha elinye. Ngokuphuhliswa kwenkqubo, iimfuno zenkqubo yokucoca ziba phezulu kwaye ziphezulu, kwaye ukusetyenziswa kwendlela yokutshiza kuya kuba kuninzi.

Icocwa ngokomisa

Njengoko igama libonisa, ukucocwa okomileyo akukona ukusetyenziswa kweekhemikhali ze-solvents okanye amanzi adibeneyo, kodwa ukusetyenziswa kwegesi okanye i-plasma ukucoca. Ngokuqhubela phambili okuqhubekayo kwee-nodes zobuchwepheshe, iimfuno zenkqubo yokucoca ziba phezulu kwaye ziphezulu, umlinganiselo wokusetyenziswa uyanda, kwaye ulwelo olulahlwayo oluveliswa ngokucoca okumanzi lukwanyuka kakhulu. Xa kuthelekiswa nokucoca okumanzi, ukucocwa okomileyo kuneendleko eziphezulu zotyalo-mali, ukusebenza kwezixhobo ezinzima kunye neemeko zokucoca ezinzima. Nangona kunjalo, ukususwa kwezinye izinto eziphilayo kunye ne-nitrides, i-oxides, ukuchaneka kokucoca okomileyo kuphezulu, umphumo uhle kakhulu.

Umlinganiselo ochanekileyo

Sineetalente kuphando lwezinto eziphathekayo, uphuhliso lwemveliso, ukuyila, ukuvelisa kunye nolawulo lomgangatho, kwaye sineseti epheleleyo yokuchaneka komatshini kunye nezixhobo zokuvavanya: ukulungelelanisa ezintathu, imitha yobunzima, imitha ye-concentricity, isixhobo sokulinganisa i-diameter yangaphandle, imitha ye-cylindricity yezixhobo zokuvavanya ukuchaneka. Inkqubo yokuvelisa engqongqo kunye nemveliso echanekileyo ephezulu kunye nezixhobo zokuvavanya ukuqinisekisa umgangatho ophezulu weemveliso.

DLC Coating

I-DLC yokugqoka, eyaziwa ngokuba yi-diamond-efana ne-diamond, enobunzima obuphezulu (>HV1500) kunye ne-coefficient ephantsi ye-friction coefficient (0.05-0.1). Lubricating self-free lubricating coating. Iimpawu zokugquma kwe-DLC zinokutshabalalisa umbane omileyo, umnyama awubonakalisi ukukhanya, ubukhulu bunokufikelela kwi-0.55um, ngoko akukho mfuneko yakukhathazeka malunga nobungakanani benkathazo. Kwaye kunye netekhnoloji yamva nje yokwenza imveliso ine-lubrication elungileyo, ukuchithwa kobushushu (omileyo). Ubomi bomsebenzi bunganyuswa ngamaxesha angama-10-50, kwaye ukusebenza kakuhle kunokunyuswa ngama-600%, ukwenzela ukunciphisa iindleko zokuvelisa. I-Fountyl isandula ukuzisa iingubo ze-DLC kwi-alumina yethu, ii-silicon carbide ze-ceramic wafer carriers, i-vacuum chucks kwaye ngakumbi iimveliso ze-silicon carbide pin chucks.

Iitafile ze-wafer carrier / gripper zisetyenziselwa ukuqulatha i-Si, i-SiC, i-GaAs, i-Gan, kunye nezinye iifestile ze-semiconductor kwiinkqubo ezahlukeneyo ze-semiconductor, ukusuka ekubhaqweni ukuya kwi-lithography, kunye nezinye izicelo ezichanekileyo eziphezulu, kubandakanywa izindlu ezinkulu, ezithambileyo eziguquguqukayo zepaneli ezibonisa , MEMS, kunye neeseli zebhayoloji. Iingubo ze-DLC zineepropati ezininzi ezinqwenelekayo, ezifana nokuxhathisa ixesha elide kunye ne-thermal conductivity ephezulu, ukwandisa ubomi bemveliso, ukugcina ukuchaneka, kunye nokunciphisa ukungqubuzana kunye nokungcoliswa. I-vacuum gripper iquka umzimba oqinileyo onezinto ezininzi zokubamba kumphezulu we-wafer okanye ipaneli, kwaye ukutenxa kwendawo yonke kunye ne-flatness yendawo ilinganiswa ngee-nanometers, kulo mzekelo, ingxaki ngokufaka i-DLC yokwambathisa kuwo wonke umphezulu we-nanometers. i-gripper kukuba ukungafani kokwandisa kwe-thermal kunokukhokelela ekulahlekelweni kwe-flatness.

I-Teflon™ i-fluoropolymer yokwenziwa kwe-semiconductor

I-Teflon™ fluoropolymers engasebenziyo ngokwekhemikhali ivumela izixhobo kunye neenkqubo ezifunekayo ukuhambisa ukusebenza okuphezulu, iigesi ezingangcolisi kunye neekhemikhali kwinkqubo yokwenziwa kwetshiphu. Sinokwenza iingubo zeTeflon kwiimveliso ze-ceramic, ezi zithembekileyo eziphezulu ze-fluoropolymers zinokufikelela:

1. I-Fluoropolymer ibonisa ukumelana neekhemikhali ezibalaseleyo, ezinokuqinisekisa ukuba iikhemikhali ezinobungozi kakhulu kwinkqubo yokwenziwa kwe-chip aziyi kungcolisa indawo ecocekileyo kakhulu.

2. Iimpawu eziphezulu ze-elektroniki (ezifana ne-dielectric ephantsi rhoqo kunye ne-low loss factor) kunye nokukhusela okugqwesileyo kwe-UV kunye nokumelana nokufuma kubalulekile kwi-package yezinga eliphezulu le-wafer.

3. I-resin ye-Fluoropolymer yenze inkqubela phambili ebalulekileyo ekuguqeni ubomi, ukunyanzeliswa kweekhemikhali ukuchasana nokuqhekeka kunye ne-weldability, efanelekileyo kwiindawo ezijongene nokucoca okuphezulu kwamanzi.

4. Amacandelo kunye nezixhobo ezenziwe ngeemveliso zeTeflon™ zisebenza kakuhle nasemva kokuba sesichengeni ixesha elide kwiikhemikhali ezisebenza kakhulu. Kwimveliso yesekethe edibeneyo, amacandelo enziwe ngeemveliso zeTeflon ™ zithintela ukungcoliseka kwamanzi emva kokusetyenziswa, ukugcina isivuno esiphezulu senkqubo kunye nokuzinza kokusebenza.

5. Ukwenziwa kweSemiconductor kubandakanya iinkqubo ezininzi ezinzima. Imveliso nganye yeTeflon™ fluoropolymer iyilelwe ukuhlangabezana neyona migangatho iphezulu yococeko, ukuthembeka kunye nokuqina.