Aluminum silicon carbide structrual ʻāpana i hoʻohana ʻia no ka mokulele, aerospace, moku moana, kaʻa kaʻa, kahua kaʻa kaʻa hou.

Hoʻohālikelike i nā waiwai o AISIC me nā metala kuʻuna a me nā mea seramika:

ʻO ke kino a me ke kino kiʻekiʻe alumini silicon carbide composite mea a mākou i lawe ai i ka hoʻomākaukau ʻana i ka hana hana hou me ka ʻole o ka pae interface, e pale pono ai i nā hemahema o ka brittleness o nā mea metala ceramic composite, a hoʻomaikaʻi nui i ka hana hana a me ka hoʻohana ʻana o nā mea.

1. Aluminum silicon carbide - structural parts

ʻO nā ʻāpana kikoʻī kiʻekiʻe kiʻekiʻe - me nā hiʻohiʻona o ka māmā, ʻoʻoleʻa kiʻekiʻe, ke kūpaʻa dimensional, ke kūpaʻa ʻana a me ka pale ʻana i ka corrosion, ma kahi o ke alumini alumini, ke kila kila, ka alloy titanium, hoʻohana ʻia i nā ʻāpana kiʻekiʻe, ʻaʻahu-kū pale i nā ʻāpana me nā koi counterweight .

ʻO ka microelectronic cooling substrate/shell: ʻike ʻia ka alumini silicon carbide ʻo ke kolu o ka hanauna o nā mea hoʻopihapiha uila no kāna mau waiwai kino wela, a hoʻohana nui ʻia i ke kahua o ka ʻeke uila (ʻo ka hanauna mua e like me ka alumini, keleawe; ʻO ka lua o ka hanauna e like me e like me Kewa, copper molybdenum, keleawe tungsten alloy....etc).

ʻO nā mea maikaʻi o ka huahana: ʻO ka hoʻokō wela kiʻekiʻe, ka hoʻolālā ʻokoʻa o ka hana o ka ʻili, ka hoʻonui haʻahaʻa wela haʻahaʻa (e like me ka coefficient hoʻonui wela o ka mea chip) Haʻahaʻa wiliwili porosity.

ʻO ka pāpaʻa waihona waihona IGBT: ʻO ka conductivity thermal o ka alumini silicon carbide he kiʻekiʻe a haʻahaʻa haʻahaʻa ka hoʻonui ʻana i ka wela (ua like ka hoʻonui ʻana o ka wela me ka mea chip), hoʻemi maikaʻi i ka hiki ʻana o ka pōʻai pōʻai, hoʻomaikaʻi i ke ola lawelawe o ka huahana. Ma ke kaʻa kaʻa kiʻekiʻe, nā kaʻa ikehu hou, ka radar, ka mana makani e hoʻololi i ka aluminika, ke keleawe, ke keleawe tungsten, ke keleawe molybdenum, ka beryllium, nā seramika a me nā mea hoʻopili microelectronics ʻē aʻe.