Ile
Awọn ọja
Apa igbekale ohun alumọni ohun alumọni carbide ti a lo fun ọkọ oju-ofurufu, afẹfẹ, awọn ọkọ oju omi omi, gbigbe ọkọ oju-irin, aaye awọn ọkọ agbara titun
Ifiwera awọn ohun-ini ti AISIC pẹlu irin ibile ati awọn ohun elo seramiki:
| aluminiomu alloy (7050) | titanium alloy (TC4) | irin alagbara (SUS304) | SIC | Alumina | AISiC | |
| Ìwúwo (g/cm3) | 2.8 | 4.5 | 7.9 | 3.2 | 3.97 | 2.8-3.2 |
| Agbara itẹsiwaju (MPa) | ≥496 | ≥985 | ≥520 | - | - | 270-450 |
| Modulu rirọ (Gpa) | 69 | 110 | 210 | 330 | 300 | 160-280 |
| Agbara atunse (Mpa) | - | - | - | 350-600 | 290 | 230-450 |
| Iṣatunṣe ti imugboroosi laini (× 10/℃) | mẹrin-le-logun | 8.6 | 17.3 | 4.5 | 7.2 | 4.5-16 |
| Imudara igbona (W/m·K) | 154-180 | 8 | 15 | 126 | 20 | 163-255 |
Alabọde ati giga aluminiomu ohun alumọni carbide composite ohun elo ti a gba lori titun iru iṣẹ igbaradi pẹlu ko si ni wiwo alakoso, eyi ti o fe ni yago fun awọn shortcomings ti brittleness ti awọn irin seramiki apapo ohun elo, ati ki o gidigidi mu awọn processing iṣẹ ati ohun elo ibiti o ti awọn ohun elo.
1. Aluminiomu ohun alumọni carbide - awọn ẹya igbekale
Awọn ẹya igbekalẹ ti o ni agbara to gaju - pẹlu awọn abuda ti iwuwo fẹẹrẹ, lile giga, iduroṣinṣin iwọn, resistance wọ ati resistance ipata, dipo alloy aluminiomu, irin alagbara, alloy titanium, ti a lo ni pipe-giga, awọn ẹya igbekale sooro pẹlu awọn ibeere counterweight. .
| Ìwúwo (g/cm3) | Agbara atunse (MPa) | Modulu ti rirọ (GPa) | Oṣuwọn elongation (%) | Ipin idamu (ζ,%) | Imudara igbona(W/m·K)@25℃ | Olùsọdipúpọ̀ ìmúgbòòrò laini (×10/℃) 25-200℃ | |
| S45 SiC / AI | 2.925 | 298 | 172 | 1.2 | 0.42 | 203 | 11.51 |
| S50 SiC / AI | 2.948 | 335 | 185 | / | 0.52 | 207 | 10.42 |
| S55 SiC/AI | 2.974 | 405 | 215 | / | 0.66 | 210 | 9.29 |
| S60 SiC / AI | 2.998 | 352 | 230 | / | 0.7 | 215 | 8.86 |
2. Aluminiomu ohun alumọni carbide - ooru dissipation apa
Sobusitireti itutu microelectronic / ikarahun: ohun alumọni ohun alumọni carbide ni a mọ bi iran kẹta ti awọn ohun elo iṣakojọpọ itanna fun awọn ohun-ini ti ara gbona ti o ga julọ, ati pe o lo pupọ ni aaye ti apoti itanna (iran akọkọ bii aluminiomu, Ejò; iran keji bii iru bi Kewa, Ejò molybdenum, Ejò tungsten alloy....ati be be lo).
| Ìwúwo(g/cm) | Agbara atunse (MPa) | Modulu ti rirọ (GPa) | Imudara igbona(W/m·K) @25℃ | Olùsọdipúpọ̀ ìmúgbòòrò laini (×10°/℃) 25-200°℃ | |
| T60SIC/AI | 2.998 | 260 | 229 | 220 | 8.64 |
| T65SIC/AI | 3.018 | 255 | 243 | 236 | 7.53 |
| T70SIC/AI | 3.05 | 251 | 258 | 217 | 6.8 |
| T75SIC/AI | 3.068 | 257 | 285 | 226 | 5.98 |
Awọn anfani ọja: Itọpa ti igbona giga, iṣẹ dada oniruuru oniruuru, Imudara imugboroja igbona kekere (bii iwọn imugboroja igbona ti ohun elo chirún) porosity alurinmorin kekere.
Awo ipilẹ package IGBT: Imudani igbona ti ohun alumọni ohun alumọni carbide jẹ giga ati kekere imugboroja imugboroja igbona (ilana imugboroja igbona jẹ iru si ohun elo chirún), ni imunadoko iṣeeṣe ti wiwapa Circuit package, mu igbesi aye iṣẹ ti ọja dara. Ni iṣinipopada iyara-giga, awọn ọkọ agbara titun, radar, iran agbara afẹfẹ lati rọpo aluminiomu, Ejò, tungsten Ejò, molybdenum Ejò, beryllium, awọn ohun elo amọ ati awọn ohun elo iṣakojọpọ microelectronics miiran.
| Awọn ohun elo | Ìwúwo (g/cm*) | Iṣatunṣe ti imugboroosi laini (x 10°/°C) | Imudara igbona (W/m·K) | Lile kan pato(Gpa cm/g) |
| AISIC | 2.8-3.2 | 4.5-16 | 163-255 | 76-108 |
| Pẹlu | 8.9 | 17 | 393 | 5 |
| AI (6061) | 2.7 | mẹta-le-logun | 171 | 25 |
| Iwe akosile | 8.3 | 5.9 | 14 | 16 |
| Invar | 8.1 | 1.6 | 11 | 14 |
| Ku/Mo(15/85) | 10 | 7 | 160 | 28 |
| Kú/W(15/85) | 17 | 7.2 | 190 | 16 |